Micro-mechanical testing of SiLK by nanoindentation and substrate curvature techniques

Gonda, Viktor; Jansen, K.M.B.; Ernst, L.J.; Toonder, Jaap M.J. den; Zhang, G.Q.

doi:10.1016/j.microrel.2006.09.033

Cited by 8 publications

(4 citation statements)

References 3 publications

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“…From the detected mechanical impedance, the complex modulus of the testing specimen was then deduced by using a viscoelastic model. For thin films, Gonda et al [5] used nanoindentation experiments to determine the viscoelastic properties of a thin polymer film on a silicon substrate. They kept a constant indent load and measured the time-dependent displacement.…”

Section: Fabrication Of Photo Resist Thin Filmsmentioning

confidence: 99%

Dynamic mechanical properties of photo resist thin films

2007

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Photo resist thin films have mainly been used and investigated for versatile applications of micro electronic mechanical systems because of its outstanding aspect ratio and attainable film thickness. An accurate structure properties derived from validated material characterization is required in engineering applications. In this work, dynamic responses of photo resist thin films are tested by a nanoindentation in association with a dynamic mechanical analysis, where the thin film is coated on a silicon wafer by spin coating. The results show that the storage modulus of the photo resist thin film remains constant at the beginning and then increases as the indentation depth increases. Meanwhile, the loss modulus increases as the indentation depth increases. Varying the film thickness shows that the substrate effect plays an important role in determining the dynamic properties of thin films. However, the results agree well with the bulk material when the amplitude of nanoindentation is relatively small. It illustrates the dynamic mechanical analysis can be an efficient method to characterize the viscoelastic properties of thin films, but proper attention on the test parameters is needed.

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Section: Fabrication Of Photo Resist Thin Filmsmentioning

confidence: 99%

Dynamic mechanical properties of photo resist thin films

2007

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“…Hot nanoindentation has also been developed for probing submicron-sized volumes in coatings and thin films. [37][38][39][40][41][42][43][44][45] However, interpretation of results from such testing modalities often involves assumptions about testing geometry and substrate effects, and temperatures are limited to above room temperature. Tensile testing can provide truly uniaxial deformation with fewer constraints on sample geometry, from which the full suite of mechanical behavior can be directly obtained.…”

Section: Introductionmentioning

confidence: 99%

Temperature controlled tensile testing of individual nanowires

Chen

Terrab

Murphy

et al. 2014

Review of Scientific Instruments

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We present a novel experimental method for quantitatively characterizing the temperature-dependent mechanical behavior of individual nanostructures during uniaxial straining. By combining a microelectromechanical tensile testing device with a low thermal mass and digital image correlation providing nm-level displacement resolution, we show successful incorporation of a testing platform in a vacuum cryostat system with an integrated heater and temperature control. Characterization of the local sample temperature and time-dependent response at both low and high temperature demonstrates a testing range of ∼90-475 K and steady-state drift rates less than 0.04 K/min. In situ operation of the tensile testing device employing resistively heated thermal actuators while imaging with an optical microscope enables high-resolution displacement measurements, from which stress-strain behavior of the nanoscale specimens is deduced. We demonstrate the efficacy of our approach in measuring the temperature dependence of tensile strength in nominally defect-free ⟨110⟩ Pd nanowhiskers. We uncover a pronounced sensitivity of the plastic response to testing temperature over a range of ∼300 K, with an ultimate strength in excess of 6 GPa at low temperature. The results are discussed in the context of thermally activated deformation mechanisms and defect nucleation in defect-free metallic nanostructures.

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“…Several experimental methods have been developed to test film properties, such as micro-tensile testing [7], nanoindentation methods [8,9], substrate curvature technique [10], and so on. However, these methods were accompanied by complicated calculation process.…”

Section: Introductionmentioning

confidence: 99%