2016
DOI: 10.1016/j.mfglet.2016.05.001
|View full text |Cite
|
Sign up to set email alerts
|

Micro-grooving into thick CVD diamond films via hollow-cathode oxygen plasma etching

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
2
1

Citation Types

0
3
0

Year Published

2017
2017
2022
2022

Publication Types

Select...
5
1

Relationship

1
5

Authors

Journals

citations
Cited by 9 publications
(3 citation statements)
references
References 12 publications
0
3
0
Order By: Relevance
“…In particular, higher etching rate of diamond coatings than the conventional etching methods with use of CF 4 is preferable for practical applications. As had reported in reference [15], no residuals of diamond films are analyzed to be present by the Raman spectroscopy. Sharp edge formation as well as no residual formation of diamonds by the present etching must be key-technological items in fabrication of diamond bio-MEMS and NEMS.…”
Section: Discussionmentioning
confidence: 93%
See 1 more Smart Citation
“…In particular, higher etching rate of diamond coatings than the conventional etching methods with use of CF 4 is preferable for practical applications. As had reported in reference [15], no residuals of diamond films are analyzed to be present by the Raman spectroscopy. Sharp edge formation as well as no residual formation of diamonds by the present etching must be key-technological items in fabrication of diamond bio-MEMS and NEMS.…”
Section: Discussionmentioning
confidence: 93%
“…Since CF 4 is a typical hazard gas to be post-treated in the closed system to avoid from direct emission in air. The authors have been developing the high density oxygen plasma etching and ashing method for DLC-and diamond-coated tools and dies [11][12][13][14][15]. Since only a pure oxygen gas is used in practice, every etching process can be done in open to air.…”
Section: Introductionmentioning
confidence: 99%
“…Further development resulted in hollow cathode utilization with greatly increased plasma density and high erosion rates. [17][18][19] However, implementation of the hollow cathode places some limitations on the batch size and uniformity, due to the localized plasma hot spot, moreover increased plasma density results in increased substrate temperature that might result in deterioration of the substrate materials, especially the HSS. Another downside of the oxygen ashing method is its inefficiency in the case of metal-based ceramic films.…”
Section: Introductionmentioning
confidence: 99%