Micro Electro Mechanical System Design

Allen, James J.

doi:10.1201/9781420027754

Cited by 117 publications

(53 citation statements)

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“…1 In the fabrication of microelectromechanical systems ͑MEMS͒ such as gyroscopes, rf switches, and resonators, layers of metals are often deposited under vacuum conditions. 2 Additionally, vacuum depositions represent a major element of bottom-up nanofabrication technologies. 3 The deposition of thin films can be performed using various techniques including electron-beam assisted physical vapor deposition ͑EBPVD͒, 4 molecular beam epitaxy, 5 chemical vapor deposition, 6 and sputtering of particles by energetic ion bombardment.…”

Section: Introductionmentioning

confidence: 99%

Direct simulation Monte Carlo modeling of e-beam metal deposition

Venkattraman

Alexeenko

2010

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

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Three-dimensional direct simulation Monte Carlo ͑DSMC͒ method is applied here to model the electron-beam physical vapor deposition of copper thin films. Various molecular models for copper-copper interactions have been considered and a suitable molecular model has been determined based on comparisons of dimensional mass fluxes obtained from simulations and previous experiments. The variable hard sphere model that is determined for atomic copper vapor can be used in DSMC simulations for design and analysis of vacuum deposition systems, allowing for accurate prediction of growth rates, uniformity, and microstructure.

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Section: Introductionmentioning

confidence: 99%

Direct simulation Monte Carlo modeling of e-beam metal deposition

Venkattraman

Alexeenko

2010

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

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“…A review of materials and fabrication techniques that has relevance to microprocess reaction systems is provided in several dedicated monographs (Allan, 2005;Madou, 2002). Commonly used materials and fabrication methods have also been reviewed over the past decade in the chapter of a monograph on microreactors (Ehrfeld et al, 2000b), in a chapter of an edited volume on micro process engineering (Brandner et al, 2006), and in several journal publications (Dietrich et al, 1996;Freitag et al, 2001;Hessel and Löwe, 2003a;Dietrich et al, 2005).…”

Section: Microreactor Materials and Fabrication Methodsmentioning

confidence: 99%

Microreactor technology and process miniaturization for catalytic reactions—A perspective on recent developments and emerging technologies

Mills

Quiram²,

Ryley

2007

Chemical Engineering Science

201

126

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“…Thin films find applications in various technologies ranging from nano-and microelectromechanical systems 1 to optics and coatings in aerospace systems. Thin films of conductors, insulators, and semiconductors used in the fabrication of microelectronic devices, 2 high-precision mirrors, and thermal barrier coatings used in gas turbine engines to improve performance and reliability are some examples of the applications of thin films.…”

Section: Introductionmentioning

confidence: 99%

Direct simulation Monte Carlo study of effects of thermal nonuniformities in electron-beam physical vapor deposition

Venkattraman

Alexeenko

2011

Journal of Vacuum Science &Amp; Technology A: Vacuum, Surfaces, and Films

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In a typical electron-beam physical vapor deposition system, there is limited control over how the high-power electron beam heats the metal surface. This leads to thermal nonuniformities at the melt. Three-dimensional direct simulation Monte Carlo simulations were performed with the aim of quantifying the effect of such spatial variations of source temperature in thin film depositions using an electron-beam physical vapor deposition system. The source temperature distribution from a typical deposition process was used in the direct simulation Monte Carlo simulations performed for various mass flow rates. The use of an area-averaged temperature is insufficient for all mass flow rates due to the highly nonlinear relationship between temperature and saturation number density, and hence, the mass flux. The mass flow rate equivalent temperature was determined, and the simulations performed with this temperature were compared with those corresponding to the actual nonuniform temperature distribution. For low mass flow rates, the growth rates depend very weakly on the spatial variation of temperature as long as an equivalent temperature corresponding to the same mass flow rate was used. However, as the mass flow rate increases, the error associated with this approximation increases. For deposition processes with source Knudsen numbers less than 0.05, it is not possible to account for the spatial nonuniformities in temperature using the total mass flow rate without significant errors. For a given mass flow rate, the errors associated with using an equivalent temperature decrease with increasing collector plane distance since the flow is allowed to expand further, thereby decreasing the effects of slit temperature nonuniformities.

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Micro Electro Mechanical System Design

Cited by 117 publications

References 0 publications

Direct simulation Monte Carlo modeling of e-beam metal deposition

Direct simulation Monte Carlo modeling of e-beam metal deposition

Microreactor technology and process miniaturization for catalytic reactions—A perspective on recent developments and emerging technologies

Direct simulation Monte Carlo study of effects of thermal nonuniformities in electron-beam physical vapor deposition

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