Micro-cutting of single-crystal metal: Finite-element analysis of deformation and material removal

Liu, Qiang; Roy, Anish; Tamura, Shoichi; Matsumura, Takashi

doi:10.1016/j.ijmecsci.2016.09.021

Cited by 33 publications

(11 citation statements)

References 42 publications

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“…For anisotropic materials, such as the single-crystal material, a crystal plasticity theory was developed to help investigating the anisotropic plastic deformation considering the crystal orientation and activated slip systems [24]. The crystal plasticity theory has been implemented in FEM to study the micro-compression [25] and micro-cutting [26,27] behaviors of single-crystal materials. In FEM simulations, the meshing strategy is an important factor in influencing the simulation results.…”

Section: Methodsmentioning

confidence: 99%

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Fang

2018

Nanomanuf Metrol

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Micro-and nano-machining technology has been applied in industry to generate high-precision parts with micro/nanometric accuracy or feature size in the recent decades. Cutting is one of the most powerful manufacturing processes, and the material removal mechanism is urgently demanded by the industry to understand and improve the micro/nano-machining process efficiently at a low cost. This paper presents the recent advances in cutting mechanism and its applicability for predicting the surface generation and chip formation, especially when material is removed in micro-and nanoscale. In addition to the industry-concerned performance parameters, fundamental physical parameters such as stresses, strains, temperatures, phase transformation, minimum uncut chip thickness and size effects are discussed in this paper for the indepth understanding of the micro/nano-cutting process.

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Section: Methodsmentioning

confidence: 99%

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Fang

2018

Nanomanuf Metrol

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“…For the convenience of reader, the crystal-plasticity theory adopted in this study is described in short [25]. A deformation gradient, F , is a composition of elastic and plastic parts:…”

Section: Single-crystal Plasticity Theorymentioning

confidence: 99%

Indentation in single-crystal 6H silicon carbide: Experimental investigations and finite element analysis

Pang

Tymicki

Roy

2018

International Journal of Mechanical Sciences

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Silicon carbide (SiC) is a promising material ideally suited for small-scaled devices deployed in harsh environments. SiC is brittle in bulk form, however, at small component length-scales plasticity is observed. A good understanding of deformation behaviour is, therefore, crucial for reliable small-scale component design and fabrication. Here, experimental and numerical analysis of the deformation behaviour of single-crystal 6H-SiC in nanoindentation is presented. Nanoindentation studies are carried out in two orientations of the single-crystal using a Berkovich indenter. Next, a crystal-plasticity theory was implemented in finiteelement (FE) modelling framework to predict the deformation of the hexagonal single-crystal. The validity of the present FE modelling methodology was corroborated through comparison between FE simulations and experimental data in terms of indent profile and loaddisplacement curves. Our results showed that classical crystal plasticity theory can be reliably applied in predicting plastic deformation of ceramic at small scales.

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“…Lee et al explored material anisotropy-induced variations of shear angle and cutting force in diamond cutting of polycrystalline copper by crystal plasticity finite element (CPFE) simulations [29]. Liu et al performed CPFE simulations to successfully capture the influence of crystallographic orientation on the cutting force, chip morphology, and pile-up profile in cutting processes of single crystalline copper [30]. More recently, Wang et al presents CPFE modeling and simulations of orthogonal diamond cutting of polycrystalline copper and corresponding experimental validation, in which the crystallographic orientations of individual grains between simulations and experiments are the same with electron backscatter diffraction (EBSD) characterization and corresponding Euler angles mapping [22,28].…”

Section: Introductionmentioning

confidence: 99%

Anisotropy-Related Machining Characteristics in Ultra-Precision Diamond Cutting of Crystalline Copper

Wang

Zhang

et al. 2020

Nanomanuf Metrol

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Deformation behavior at grain levels greatly affects the machining characteristics of crystalline materials. In the present work, we investigate the influence of material anisotropy on ultra-precision diamond cutting of single crystalline and polycrystalline copper by experiments and crystal plasticity finite element simulations. Specifically, diamond turning and in situ SEM orthogonal cutting experiments are carried out to provide direct experimental evidence of the material anisotropy-dependent cutting results in terms of machined surface morphology and chip profile. Corresponding numerical simulations with the analysis of built stress further validate experimental results and reveal the mechanisms governing the material anisotropy influence. The above findings provide insight into the fabrication of ultra-smooth surfaces of polycrystalline metals by ultraprecision diamond turning.

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Micro-cutting of single-crystal metal: Finite-element analysis of deformation and material removal

Cited by 33 publications

References 42 publications

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Recent Advances in Micro/Nano-cutting: Effect of Tool Edge and Material Properties

Indentation in single-crystal 6H silicon carbide: Experimental investigations and finite element analysis

Anisotropy-Related Machining Characteristics in Ultra-Precision Diamond Cutting of Crystalline Copper

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