Anisotropy-Related Machining Characteristics in Ultra-Precision Diamond Cutting of Crystalline Copper

Wang, Zhanfeng; Zhang, Junjie; Li, Guo; Xu, Zongwei; Zhang, Haijun; Zhang, Jianguo; Hartmaier, Alexander; Yan, Yongda; Sun, Tao

doi:10.1007/s41871-020-00060-9

Cited by 23 publications

(7 citation statements)

References 36 publications

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“…Anisotropy is a serious problem in the nano-cutting process of the crystal [ 26 , 27 ], including the single-crystal gallium arsenide. Due to its single-crystal structure, gallium arsenide crystal shows distinct properties in different crystal orientations.…”

Section: Resultsmentioning

confidence: 99%

Subsurface Deformation Mechanism in Nano-cutting of Gallium Arsenide Using Molecular Dynamics Simulation

Chen

Lai

2021

Nanoscale Res Lett

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During the nano-cutting process, monocrystalline gallium arsenide is faced with various surface/subsurface deformations and damages that significantly influence the product’s performance. In this paper, molecular dynamics simulations of nano-cutting on gallium arsenide are conducted to investigate the surface and subsurface deformation mechanism. Dislocations are found in the machined subsurface. Phase transformation and amorphization are studied by means of coordination numbers. Results reveal the existence of an intermediate phase with a coordination number of five during the cutting process. Models with different cutting speeds are established to investigate the effects on the dislocation. The effect of crystal anisotropy on the dislocation type and density is studied via models with different cutting orientations. In addition, the subsurface stress is also analyzed.

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Section: Resultsmentioning

confidence: 99%

Subsurface Deformation Mechanism in Nano-cutting of Gallium Arsenide Using Molecular Dynamics Simulation

Chen

Lai

2021

Nanoscale Res Lett

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“…Numerous researchers have investigated the machining of copper using diamond tools using experimental and theoretical methods [16][17][18][19][20]. However, the nature of adhesion and atomic effects have rarely been investigated.…”

Section: Introductionmentioning

confidence: 99%

Insight into Atomic-Scale Adhesion at the C–Cu Interface During the Initial Stage of Nanoindentation

et al. 2022

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Adhesion is a common phenomenon in nanomachining which affects processing accuracy and repeatability. As material removal approaches the atomic or close-to-atomic scale, quantum mechanics becomes the dominant principle behind the atomic-level interaction. However, atomic-scale effects cannot be properly described by empirical potential function-based molecular dynamics simulations. This study uses a first-principles method to reveal the atomic-scale adhesion between a diamond tip and a copper slab during initial-stage nanoindentation. Using a simplified tip and slab model, adhesion energy, electronic distribution, and density of states are analyzed based on quantum chemistry calculation. Results show that atomic adhesion is primarily due to the covalent bonding interaction between C and Cu atoms, which can induce structural changes to the diamond tip and copper slab. The effects of tip position and angles on adhesion are further studied through a series of simulations. The results show that adhesion between the tip and slab is sensitive to the lattice structure and a variant in angstroms is enough to cause different adhesion and structural changes. The actual determinants of adhesion can only be the atomic and electronic structures at the tip–slab interface. Bond rotation and breakage are observed during simulation and their effects on adhesion are further discussed. To conclude, the first-principles method is important for the analysis of an atomic-scale interaction system, even if only as an aid to describing adhesion at atomic and electronic scales.

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“…Fan et al [12] simulated the changes of physical quantities such as cutting temperature, cutting force and coordination number in single-crystal GaAs during single-point diamond turning (SPDT) through MD simulation, and found that the anisotropy of GaAs would affect the final cutting performance. Wang et al [13] studied the influence of material anisotropy on cutting of single crystal and polycrystalline copper, revealing the internal mechanism, providing insight into the fabrication of ultra-smooth surface of polycrystalline metals by ultra-precision diamond turning. Zhou et al [14] used molecular dynamics simulation to study the changes of the surface roughness after nanometric cutting.…”

Section: Introductionmentioning

confidence: 99%

Nanometric cutting mechanism of cerium-lanthanum alloy

Zhao

Lai

2022

Preprint

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Molecular dynamics (MD) simulation is an effective approach to reveal the atomic-scale details of the material removal mechanism in nanometric cutting. In this study, through a MD simulation, we analyze the effects of cutting speed and cutting depth on cutting force and subsurface deformation of the cerium–lanthanum alloy during nanometric cutting. The results illustrate that the dislocations, stacking faults, and phase transitions occur on the material subsurface during the cutting process. The dislocations are mainly Shockley partial dislocation, and increasing the temperature and pressure during the cutting process leads to the transformation of γ-Ce (FCC) into β-Ce (HCP) and δ-Ce (BCC). β-Ce is mainly distributed in the stacking fault area, while δ-Ce is distributed in the boundary area between the dislocation atoms and γ-Ce atoms. The cutting speed and cutting depth are important factors affecting the distribution of subsurface damage. A thicker subsurface deformed layer on the machined surface, comprising dislocations, stacking faults, and lattice defects, is generated with an increase in the cutting speed and cutting depth. Simultaneously, the cutting speed and cutting depth significantly affect the cutting force, material removal rate, and generated subsurface state. The fluctuations in the cutting force are related to the generation and disappearance of dislocations. The higher the cutting speed and the deeper the cutting depth, the more phase-transition atoms on the subsurface.

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Anisotropy-Related Machining Characteristics in Ultra-Precision Diamond Cutting of Crystalline Copper

Cited by 23 publications

References 36 publications

Subsurface Deformation Mechanism in Nano-cutting of Gallium Arsenide Using Molecular Dynamics Simulation

Subsurface Deformation Mechanism in Nano-cutting of Gallium Arsenide Using Molecular Dynamics Simulation

Insight into Atomic-Scale Adhesion at the C–Cu Interface During the Initial Stage of Nanoindentation

Nanometric cutting mechanism of cerium-lanthanum alloy

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