Micro cantilever probe array integrated with Piezoresistive sensor

Yang, Zunxian; Li, Xinxin; Wang, Yuelin; Bao, Haifei; Liu, Min

doi:10.1016/j.mejo.2003.12.001

Cited by 18 publications

(6 citation statements)

References 4 publications

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“…In addition, sensing static cantilever detection is difficult with this method. At present, most self-sensing cantilevers use a piezoresistive method for displacement measurement due to the simplification and compatibility of sensor integration [102,108,109]. A simple integration of piezoresistive sensors eliminates the need for optical alignment of the external readout.…”

Section: Integrated Cantilever Devices For Probing the Nanoscalementioning

confidence: 99%

“…Due to increasingly demanding scientific and industrial requirements, smaller and highly efficient cantilevers for force-displacement detection and surface investigation have been developed using integrated cantilevers with sensors, actuators and heaters [109,113,114]. In addition to surface imaging, the well-known four-point probe has been minimized into a microcantilever-style probe to perform reliable measurements of electronic transport properties in semiconductors.…”

Section: Integrated Cantilever Devices For Probing the Nanoscalementioning

confidence: 99%

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Integrated microcantilevers for high-resolution sensing and probing

Li¹,

Lee

2011

Meas. Sci. Technol.

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This topical review is focused on microcantilever-based sensing and probing functions that are realized by integrating a mechanically compliant cantilever with self-sensing and self-actuating elements, specific sensing materials as well as functionalized nano-tips. Such integrated cantilever devices have shown great promise in ultra-sensitive applications such as on-the-spot portable bio/chemical detection and in situ micro/nanoscale surface analysis and manipulation. The technical details of this review will be given in a sequence of cantilever sensors and, then, cantilever-tip probes. For the integrated cantilever sensors, the frequency-output style dynamic cantilevers are described first, with the contents including optimized resonance modes, sensing-group-modified nanostructures for specific bio/chemical mass adsorption and nanoscale sensing effects, etc. Thereafter, the static cantilever sensors for surface-stress detection are described in the sequence of the sensing mechanism, surface modification of the sensitive molecule layer and the model of specific reaction-induced surface-energy variation. After technical description of the cantilever sensors, the emphasis of the review moves to functionalized nano-tip equipped cantilever-tip probing devices. The probing functions are not only integrated on the cantilever but also integrated at the sharp apex of the tip. After description of single integrated cantilever probes and their applications in surface scanning and imaging, arrayed cantilever-tip devices and their simultaneous parallel operation for high throughput imaging and nanomechanical data storage are also addressed. With cantilever-tip probes as key elements, micro-analysis instruments are introduced that can be widely used for macro/nanoscale characterizations.

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Section: Integrated Cantilever Devices For Probing the Nanoscalementioning

confidence: 99%

Section: Integrated Cantilever Devices For Probing the Nanoscalementioning

confidence: 99%

Integrated microcantilevers for high-resolution sensing and probing

Li¹,

Lee

2011

Meas. Sci. Technol.

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“…The stage is placed on a Seiko SPA-400 scanning probe microscopy (SPM). A kind of cantilever-tip SPM probe has been developed in our lab [32]. The nano tip can be controllably electric-heated within the time constant of microseconds.…”

Section: Characterizationmentioning

confidence: 99%

Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology

Bao

et al. 2006

J. Micromech. Microeng.

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For operation and manipulation with nanometric positioning precision, a single crystalline silicon micro XY-stage is developed by using double-sided bulk-micromachining technology. Front-side deep reactive ion etching combined with backside anisotropic etching constructs the high-aspect-ratio comb-driven XY-stage in a single standard silicon wafer (i.e., no silicon on insulator wafer is used). For integrating several electrostatic actuators in one silicon chip, different actuators are electrically isolated from each other using a trench-sidewall insulating technique. SiO2-refilled trench bars are formed on vertical trench sidewalls to isolate adjacent comb-drive elements. Combined with the reverse-biased p–n junction along the boron-diffused trench sidewall for comb driving, individual actuators can be operated independently. The developed XY-stage of 1600 × 1600 µm2 is suspended by four sets of folded-beam and bending-flexure composite springs. To maximize the moving distance, a two-segment comb finger with a gently curved transition is used for both improving the actuation efficiency and avoiding side instability of the stage. The experimental results verify the stage design including the gentle transition of a two-segment comb-drive scheme. Under 23 V driving voltage, a 10 µm moving stroke is measured in each of the four directions. Compared with a conventional comb structure, the two-segment comb fingers contribute 70% improvement in actuating amplitude. The positioning precision of the stage is evaluated with a nano-mechanical indenting experiment. A scanning probe microscopy probe with an electrical-heated nano tip is put in contact with the surface of a polymethyl methacrylate film that is coated on the stage surface. Along with the movement of the stage, pulsed heating on the nano tip produces serial nano-pitches. With the nano-indenting experiment, better than 18 nm positioning precision is obtained for the XY-stage.

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“…To our knowledge, the key point of MEMS technology is its high selectivity especially in the processes of anisotropic wet etching, sacrificial layer process and dry etching [30,51]. Anisotropic wet etching is based on the fact that different crystalline planes of silicon have different etch rates in alkaline solution, including KOH, tetramethylammonium hydroxide (TMAH), etc.…”

Section: Introductionmentioning

confidence: 99%

Nanofabrication, effects and sensors based on micro-electro-mechanical systems technology

Wang

Yang

2013

Phil. Trans. R. Soc. A.

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In this paper, our investigation of nanofabrication, effects and sensors based on the traditional micro-electro-mechanical systems (MEMS) technology has been reviewed. Thanks to high selectivity in anisotropic etching and sacrificial layer processes, nanostructures such as nanobeams and nanowires have been fabricated in top-down batch process, in which beams with thickness of only 20 nm and nanowires whose width and thickness is only 20 nm were achieved. With the help of MEMS chip, the scale effect of Young's modulus in silicon has been studied and confirmed directly in a tensile experiment using electron microscopy. Because of their high surface-to-volume ratio and small size, silicon nanowire (SiNW)-based field-effect transistors (FETs) have been shown as one of the most promising electronic devices and ultrasensitive detectors in biological applications. We demonstrated that an SiNW–FET sensor can reveal ultrahigh sensitivity for rapid and reliable detection of 0.1 fM of target DNA with high specificity. All these indicate that the MEMS technology can pave the way to nanoapplications with its advantages of batch production, low cost and high performance.

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Micro cantilever probe array integrated with Piezoresistive sensor

Cited by 18 publications

References 4 publications

Integrated microcantilevers for high-resolution sensing and probing

Integrated microcantilevers for high-resolution sensing and probing

Single-wafer-processed nano-positioning XY-stages with trench-sidewall micromachining technology

Nanofabrication, effects and sensors based on micro-electro-mechanical systems technology

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