Micro bonding with non-viscous adhesives

Abstract

The new subproject B8 ''Adhesive processing in batch technology for the manufacturing of microsystems'' has the goal to compile bases for batchable joining techniques based on adhesive systems. This paper presents an alternative adhesive bonding system, which is able to join very small parts as well as relatively big parts with high accuracy requirements. The main advantages are the possibility to apply small volumes, to pre-apply the adhesive with a temporarily delayed joining procedure and extremely short set cycles. Therefore, using hot melts can be a technologically and economically interesting alternative for the assembly and packaging of MEMS.

Wafer-level BCB bonding using a thermal press for microfluidics

“…To date, many different bonding technologies have been applied (Boehm et al 2006;Kim and Najafi 2003;Ng et al 2006;Niklaus et al 2006;Venditti et al 2006), among which adhesive wafer bonding is a cost-effective and low-temperature method suitable for microfluidics.…”

“…All four kinds of polymers: thermoplastic (Boehm et al 2006), thermosetting (Liang et al 2006), elastomeric (Plecis and Chen 2007), and hybrids of these three (Niklaus et al 2006), can be used for wafer bonding. As a thermosetting polymer, benzocyclobutene (BCB), in its photosensitive form, can be used to form a microfluidic chamber by photolithography and subsequently be used as the adhesive for bonding.…”

Concepts for Hybrid Micro Assembly Using Hot Melt Joining

“…A new approach is the usage of hot melt adhesives. The main advantages are extremely short set cycles, the possibility of pre-applying the adhesive and the timedelayed joining procedure [3]. Therefore, the use of hot melt adhesives can be an interesting alternative for the assembly of hybrid micro systems.…”