Micro arc welding for electrode gap reduction of high aspect ratio microstructures

Nowack, M.; Leidich, Stefan; Reuter, Danny; Kurth, Steffen; Kuechler, Matthias; Bertz, A.; Geßner, Thomas

doi:10.1016/j.sna.2011.12.026

Cited by 10 publications

(5 citation statements)

References 8 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…Otherwise, the violent heating of the electrode and gas will destroy the experimental device. The discharge characteristics of high power and high current also make it widely used in micro-arc welding [66,67].…”

Section: Power Balancementioning

confidence: 99%

Numerical simulation of the breakdown process of micro-discharge sustained by field emission

Guo¹,

Wu²,

Peng³

et al. 2022

J. Phys. D: Appl. Phys.

View full text Add to dashboard Cite

Micro-discharge is the process that gas breakdown occurs on a small spatial scale to generate plasma. With the decrease of the discharge scale, the high electric field makes the field emission (FE) play a leading role in the breakdown process of the micro-discharge, which is one of the reasons that the breakdown voltage deviates from the Paschen curve in a small gap. A one-dimensional implicit particle-in-cell Monte Carlo collision (PIC/MCC) model is used to simulate the whole breakdown process of direct current (DC) micro-discharge sustained by FE in argon. The results show that the discharge after breakdown is in arc mode, the breakdown process can be divided into three stages: the pre-breakdown stage, the breakdown stage, and the post-breakdown stage. In the pre-breakdown stage, the sheath and plasma are not formed, the external electric field can penetrate the entire gap. In the breakdown stage, gas breakdown occurs. As the sheath is formed, the rate of change of plasma parameters increases rapidly and the discharge gap changes from capacitive to resistive. In the post-breakdown stage, the anode sheath gradually becomes thinner, but the region where the field is reversed still exists. The particle and energy balance gradually reach equilibrium, and the entire discharge evolves to a quasi-steady-state.

show abstract

Section: Power Balancementioning

confidence: 99%

Numerical simulation of the breakdown process of micro-discharge sustained by field emission

Guo¹,

Wu²,

Peng³

et al. 2022

J. Phys. D: Appl. Phys.

View full text Add to dashboard Cite

show abstract

“…While providing many advantages compared to mechanical and piezoelectric This thesis is thereby aiming to study the application of a novel transduction gap reduction technology [7] to a design of 32 kHz oscillator using a wafer-level vacuumencapsulated silicon electrostatic tuning fork resonator. For the same resonator design with reducing the transduction gap to different values, we will study the performance on DC polarization voltage, motional resistance and electrostatic stiffness.…”

Section: Problem and Objectivementioning

confidence: 99%

“…Transduction Gap Reduction Methodology normally at a much lower DC polarization voltage if a small transduction gap size is possible. A novel post-fabrication gap reduction technique is presented herein to help relax minimum transduction gap restriction to as low as 50 nm.The process starts right after the resonator device is received from the foundry after fabrication[7]. A high DC voltage of about 50V is applied to generate electrical potential difference between movable electrodes and strategically located stop anchors enclosed by the electrodes.…”

mentioning

confidence: 99%

Wafer-level vacuum-encapsulated ultra-low voltage tuning fork MEMS resonator

Huan

Xereas

Chodavarapu

2016

2016 IEEE National Aerospace and Electronics Conference (NAECON) and Ohio Innovation Summit (OIS)

View full text Add to dashboard Cite

In this thesis, a low-voltage 32 kHz silicon tuning fork MicroElectroMechanical Systems (MEMS)-based resonator design with a high Quality factor of over 73,000 is presented with a Complementary Metal-Oxide Semiconductor (CMOS) sustaining amplifier towards a low power oscillator. The resonator is designed using MEMS Integrated Design for Inertial Sensors (MIDIS) process developed by Teledyne DALSA Semiconductor Inc. (TDSI). MIDIS offers wafer-level vacuum encapsulation with ultra-low leak rate. Ultra-low polarization voltage, as low as 10mV, is needed to excite the resonator by using a transduction gap reduction technique based on electrostatic deflection of movable electrodes and subsequent localized melting of welding pads for permanent position locking. Further, the technique helps to minimize unexpected electrostatic stiffness induced by time-varying capacitance across transduction gaps to just-0.6 N/m. The motional resistance drops down to about 2kΩ as a result of a small gap size and the technique helps to improve the Quality Factor (Q). A sustaining amplifier using a transimpedance operational amplifier configuration is system-integrated with the tuning fork resonator to establish continuous oscillation with low damping losses. An average power consumption of around 600µW is measured on the oscillator, which is suitable for mobile electronic systems. v Dedicated to my parents vi ACKNOWLEDGEMENTS My special thanks to Dr. Vamsy Chodavarapu, my advisor, for giving me guidance all through my research work as well as unlimited access to the software and other resources necessary for completing the design of this work. I would also like to appreciate everyone who has offered me assistance in this work. This includes George Xereas, who spared some of his valuable time to teach me with patience how to use the CoventorWare software for MEMS-based resonator design; Balaadithya Uppalapati, who gave me the basic tutorials on how Silvaco EDA tools should be used for oscillator circuit design; and Dr. Weisong Wang, for imparting knowledge of MEMS fundamentals to me through lectures in class. I also deeply appreciate Dr. Guru Subramanyam, who provided me with several useful points on which parts I should improve regarding the work in the future. vii

show abstract

“…Therefore, the interest in microarcs is related to modern applications. Powerful but small‐sized sources can be used for melting the workpiece in additive manufacturing and for repair and re‐manufacturing of high‐value components and damaged surfaces, [ 4 ] microwelding, [ 5 ] and production of bio‐active coatings by microarc oxidation of titanium and zirconium [ 6,7 ] among others. No less than the various applications, basic research on microarcs is also hugely important.…”

Section: Introductionmentioning

confidence: 99%

Plasma parameters of microarcs towards minuscule discharge gap

Baeva

Loffhagen

Becker

et al. 2020

Contributions to Plasma Physics

View full text Add to dashboard Cite

This paper describes the behaviour of the plasma parameters of microarcs generated between a cooled copper anode and a ceriated tungsten cathode by means of a one-dimensional unified non-equilibrium model for gap lengths between 15 and 200 μm and current densities from 2 × 10 5 up to 10 6 A/m 2. The results obtained show that the decrease of the gap length to a few tens of micrometres for a given current density results in a progressive shrinking of the quasi-neutral bulk in the microplasma and its complete disappearance. The decrease of the gap length further leads to an increase of the discharge voltage and the electron temperature and to slightly less heating of the gas.

show abstract

Micro arc welding for electrode gap reduction of high aspect ratio microstructures

Cited by 10 publications

References 8 publications

Numerical simulation of the breakdown process of micro-discharge sustained by field emission

Numerical simulation of the breakdown process of micro-discharge sustained by field emission

Wafer-level vacuum-encapsulated ultra-low voltage tuning fork MEMS resonator

Plasma parameters of microarcs towards minuscule discharge gap

Contact Info

Product

Resources

About