2016 IEEE National Aerospace and Electronics Conference (NAECON) and Ohio Innovation Summit (OIS) 2016
DOI: 10.1109/naecon.2016.7856825
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Wafer-level vacuum-encapsulated ultra-low voltage tuning fork MEMS resonator

Abstract: In this thesis, a low-voltage 32 kHz silicon tuning fork MicroElectroMechanical Systems (MEMS)-based resonator design with a high Quality factor of over 73,000 is presented with a Complementary Metal-Oxide Semiconductor (CMOS) sustaining amplifier towards a low power oscillator. The resonator is designed using MEMS Integrated Design for Inertial Sensors (MIDIS) process developed by Teledyne DALSA Semiconductor Inc. (TDSI). MIDIS offers wafer-level vacuum encapsulation with ultra-low leak rate. Ultra-low polari… Show more

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