Micro- and Nanostructure of Zn Whiskers and Their Coating

Etienne, Auriane; Cadel, E.; Lina, A.; Cretinon, L.; Pareige, P.

doi:10.1007/s11664-012-2185-4

Cited by 4 publications

(5 citation statements)

References 16 publications

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“…It follows then that spontaneous Zn whisker growth can be attributed to the intrinsic near-surface electric fields due to surface imperfections. [10][11][12][13][14][15] (2) The suggested mechanism of the field-induced nucleation effect does not invalidate the earlier proposed hypotheses about the role of compressive stress as whisker driving force, [5][6][7][8][9] assuming that the stress creates local electric fields as explained in Refs. 10 and 13.…”

Section: Discussionmentioning

confidence: 99%

“…3,4 As with tin whiskers (more broadly researched), the mechanism of Zn whisker formation is not quite clear. [5][6][7][8][9] As a result, procedures for Zn whisker mitigation are lacking; neither are there accelerated life testing protocols helping to predict Zn whisker development. Here, we present data showing that the Zn whisker development from a raised floor tile can be greatly accelerated by the external electric field, a conclusion consistent with the electrostatic theory of metal whiskers [10][11][12][13] and recent observations of the field induced development of metal whiskers.…”

Section: Introductionmentioning

confidence: 99%

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Electric field stimulated growth of Zn whiskers

et al. 2016

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We have investigated the impact of strong (∼10 4 V/cm) electric fields on the development of Zn whiskers. The original samples, with considerable whisker infestation were cut from Zn-coated steel floors and then exposed to electric fields stresses for 10-20 hours at room temperature. We used various electric field sources, from charges accumulated in samples irradiated by: (1) the electron beam of a scanning electron microscope (SEM), (2) the electron beam of a medical linear accelerator, and (3) the ion beam of a linear accelerator; we also used (4) the electric field produced by a Van der Graaf generator. In all cases, the exposed samples exhibited a considerable (tens of percent) increase in whiskers concentration compared to the control sample. The acceleration factor defined as the ratio of the measured whisker growth rate over that in zero field, was estimated to approach several hundred. The statistics of lengths of e-beam induced whiskers was found to follow the log-normal distribution known previously for metal whiskers. The observed accelerated whisker growth is attributed to electrostatic effects. These results offer promise for establishing whisker-related accelerated life testing protocols. C 2016 Author(s). All article content, except where otherwise noted, is licensed under a Creative Commons Attribution (CC BY) license

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Section: Discussionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Electric field stimulated growth of Zn whiskers

et al. 2016

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“…8,9 However, other investigators have reported that no intermetallic, or only a very thin layer of Fe-Zn IMC, was present at the interface, based on which they concluded that the development of Fe-Zn IMC was not associated with zinc whisker growth. 10,11 Etienne et al correlated the recrystallisation of zinc grains with whisker growth, reporting that grains near the root of whiskers were recrystallised, 12,13 which is consistent with tin whisker growth mechanisms based on recrystallisation. [14][15][16] A more thorough overview of zinc whisker-related research can be found in a recent review paper.…”

Section: Introductionmentioning

confidence: 86%

Investigation of Whisker Growth from Alkaline Non-cyanide Zinc Electrodeposits

Ashworth

Wilcox

2016

Journal of Elec Materi

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Electroplated zinc finishes have been widely used in the packaging of electronic products for many years as a result of their excellent corrosion resistance and relatively low cost. However, the spontaneous formation of whiskers on zinc electroplated components, which are capable of resulting in electrical shorting or other damaging effects, can be highly problematic for the reliability of long-life electrical and electronic equipment. This work investigated the mechanism for whisker growth from zinc electrodeposited mild steel substrates. The incubation time for whisker growth from the surface of nodules on the surface of the electrodeposit was considerably reduced compared with that from the planar deposit surface. Recrystallisation of the as-deposited columnar structure was observed at the whisker root. This result is consistent with some recent whisker growth models based on recrystallisation. There was no evidence of iron-zinc (Fe-Zn) intermetallic formation at the iron/zinc (Fe/Zn) interface or within the zinc coating beneath the whiskers.

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“…In 2013, Etienne et al [42] presented additional experimental results to support their proposed growth mechanism based on recrystallisation. They first investigated a sample that was extracted at the root of a filament type whisker growing directly from the deposit surface.…”

Section: Zinc Whisker Researchmentioning

confidence: 97%

Zinc whisker growth from electroplated finishes – a review

Ashworth

Wilcox

2015

Transactions of the IMF

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Electroplated zinc finishes have been associated with the electronics industry for many years as a result of their excellent corrosion resistance and relatively low cost. They are normally applied onto ferrous products to provide corrosion protection in a range of different environments. However, the formation of spontaneously grown whiskers on zinc electroplated components, which are capable of resulting in electrical shorting or other damaging effects, can be highly problematic for the reliability of long life electrical and electronic equipment. The growth of zinc whiskers has been identified as the cause of some electrical and electronic failures in telecommunications and aerospace based applications, with consequences ranging from mild inconvenience to complete system failures.Investigators have been striving to address the problems induced by whisker growth since the 1940s. However, most research effort has been focused on tin whiskers; especially following European Union environmental legislation that restricted the use of lead (Pb), which when alloyed with tin (3 -10% by weight) provided effective tin whisker mitigation. Compared with tin whisker research, much less attention has been paid to zinc whiskers. A number of mechanisms to explain zinc whisker growth have been proposed, but none of them are widely accepted and some are in conflict with each other. The aim of this paper is to review the available literature in regard to zinc whiskers; to discuss the reported growth mechanisms, to evaluate the effect of deposition parameters and to explore potential mitigation methods. This paper presents a chronologically ordered review of zinc whisker related studies from 1946 to 2013. Some important early research, which investigated whisker growth in tin and cadmium, as well as zinc, has also been included.

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Micro- and Nanostructure of Zn Whiskers and Their Coating

Cited by 4 publications

References 16 publications

Electric field stimulated growth of Zn whiskers

Electric field stimulated growth of Zn whiskers

Investigation of Whisker Growth from Alkaline Non-cyanide Zinc Electrodeposits

Zinc whisker growth from electroplated finishes – a review

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