Wafer-scale, conformal, two-dimensional (2D) TiO
2
-Ga
2
O
3
n-p
heterostructures with a thickness of less than 10 nm were fabricated on the Si/SiO
2
substrates by the atomic layer deposition (ALD) technique for the first time with subsequent post-deposition annealing at a temperature of 250 °C. The best deposition parameters were established. The structure and morphology of 2D TiO
2
-Ga
2
O
3
n-p
heterostructures were characterized by the scanning electron microscopy (SEM), X-ray photoelectron spectroscopy (XPS), electrochemical impedance spectroscopy (EIS), etc. 2D TiO
2
-Ga
2
O
3
n-p
heterostructures demonstrated efficient photocatalytic activity towards methyl orange (MO) degradation at the UV light (
λ
= 254 nm) irradiation. The improvement of TiO
2
-Ga
2
O
3
n-p
heterostructure capabilities is due to the development of the defects on Ga
2
O
3
-TiO
2
interface, which were able to trap electrons faster.
Graphical Abstract