1987
DOI: 10.1016/0263-2241(87)90027-3
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Methods for the measurement of thermal conductivity and thermal diffusivity of very thin films and foils

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Cited by 24 publications
(6 citation statements)
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“…The inability to account exactly for the differences between the calculated and the actual temperature rise can be attributed to underlying uncertainties in some of the parameters used for calculation. The values of the accelerating voltages could be precisely read from the SEM, and the thermal conductivity—measured using various methods (Swann, 1959; Parrottet et al , 1975; Völklein et al , 1987; Rowe, 1995)—and the EB probe size—obtained through digital image processing (Oho et al , 1985)—were also set precisely ahead of the experiment. However, it remained difficult to obtain accurate conversion ratios or electron ranges.…”
Section: Resultsmentioning
confidence: 99%
“…The inability to account exactly for the differences between the calculated and the actual temperature rise can be attributed to underlying uncertainties in some of the parameters used for calculation. The values of the accelerating voltages could be precisely read from the SEM, and the thermal conductivity—measured using various methods (Swann, 1959; Parrottet et al , 1975; Völklein et al , 1987; Rowe, 1995)—and the EB probe size—obtained through digital image processing (Oho et al , 1985)—were also set precisely ahead of the experiment. However, it remained difficult to obtain accurate conversion ratios or electron ranges.…”
Section: Resultsmentioning
confidence: 99%
“…The thermal conductivity was measured with the 3‐omega method with an accuracy of ±10%. [ 52 ] The accuracy of the Seebeck coefficient measurement was ±7%. [ 53 ]…”
Section: Methodsmentioning
confidence: 99%
“…Because the thermal sink is positioned at the structure's edge, the in-plane thermal flow is ensured, and thus the temperature rise is governed by f,∥. [80] The chip incorporates a rectangular suspended dielectric (e.g., SiNx) membrane with a thickness of 50 to 100 nm. This membrane serves as a substrate on which the film specimen can be deposited.…”
Section: In-plane Thermal Conductivity (F∥) Measurement Volklein Met...mentioning
confidence: 99%