We present a comparison of the breakdown loci of a MESFET, PHEMT and Power PHEMT. It is based on the study of the correlation between breakdown loci and device output characteristics. This study aims at performing a technology choice for amplifier design operating in non linear conditions with operating level close to the maximum operating conditions of the transistor. We found that the MESFET is the best candidate for circuits operating in overdrive conditions as it presents abrupt on-state breakdown voltage loci and the highest breakdown voltage. [4,5], which provide breakdown loci. However, two different technologies can exhibit the same breakdown loci shape, but, not necessarily the similar mechanisms. Hence a detailed investigation of the correlation between breakdown loci and the device electrical characteristics allows to understand the mechanisms attributed to each breakdown region and for each type of device. From this study we can compare the robustness and reliability of devices operating in non linear regime and close to breakdown regions. The purpose of this work is to compare the breakdown characteristics of the 0.2 µm GaAs PHEMT, 0.5 µm GaAs MESFET and 0.25 µm GaAs Power PHEMT in order to make a technology choice for amplifier design operating in non linear conditions.