Method for Determining a Dynamical State–Space Model for Control of Thermal MEMS Devices

Borovic, B.; Lewis, Frank L.; Agonafer, Dereje; Kolesar, Edward S.; Hossain, M.M.; Popa, Dan O.

doi:10.1109/jmems.2005.851856

Cited by 22 publications

(11 citation statements)

References 10 publications

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“…Finite element analysis (FEA) is a widely reported method in the design of MEMS electrothermal actuators [200], [201], [174], [202], [22], [203]. …”

Section: B22 Numerical Methodsmentioning

confidence: 99%

Single‐Chip Scanning Probe Microscopes

Sarkar

Mansour²

2015

Micro‐ and Nanomanipulation Tools

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Scanning probe microscopes (SPMs) are the highest resolution imaging instruments available today and are among the most important tools in nanoscience. Conventional SPMs suffer from several drawbacks owing to their large and bulky construction and to the use of piezoelectric materials. Large scanners have low resonant frequencies that limit their achievable imaging bandwidth and render them susceptible to disturbance from ambient vibrations. Array approaches have been used to alleviate the bandwidth bottleneck; however as arrays are scaled upwards, the scanning speed must decline to accommodate larger payloads. In addition, the long mechanical path from the tip to the sample contributes thermal drift. Furthermore, intrinsic properties of piezoelectric materials result in creep and hysteresis, which contribute to image distortion. The tip-sample interaction signals are often measured with optical configurations that require large free-space paths, are cumbersome to align, and add to the high cost of state-of-the-art SPM systems. These shortcomings have stifled the widespread adoption of SPMs by the nanometrology community. Tiny, inexpensive, fast, stable and independent SPMs that do not incur bandwidth penalties upon array scaling would therefore be most welcome. A method to increase the quality factor (Q-factor) of flexural resonators is introduced. The method relies on an internal energy pumping mechanism that is based on the interplay between electrical, iv mechanical, and thermal effects. To the best of the author's knowledge, the devices that are designed to harness these effects possess the highest electromechanical Qs reported for flexural resonators operating in air; electrically measured Q is enhanced from ~50 to ~50,000 in one exemplary device. A physical explanation for the underlying mechanism is proposed.The design, fabrication, imaging, and tip-based lithographic patterning with the first single-chip Scanning Thermal Microscopes (SThMs) are also presented. In addition to 3 DOF scanning, these devices possess integrated, thermally isolated temperature sensors to detect heat transfer in the tip-sample region.Imaging is reported with thermocouple-based devices and patterning is reported with resistive heater/sensors. An "isothermal electrothermal scanner" is designed and fabricated, and a method to operate it is detailed. The mechanism, based on electrothermal actuation, maintains a constant temperature in a central location while positioning a payload over a range of >35μm, thereby suppressing the deleterious thermal crosstalk effects that have thus far plagued thermally actuated devices with integrated sensors.

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“…Finite element analysis (FEA) is a widely reported method in the design of MEMS electrothermal actuators [200], [201], [174], [202], [22], [203]. …”

Section: B22 Numerical Methodsmentioning

confidence: 99%

Single‐Chip Scanning Probe Microscopes

Sarkar

Mansour²

2015

Micro‐ and Nanomanipulation Tools

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“…A model consisting of millions of equations (e.g., a FEM model) is surely more difficult to handle and takes more time to solve than an analytic expression based on a simplified gray-box model. In [88], the authors determined a dynamical statespace model for control of thermal MEMS devices. The importance of temperature-dependent parameters was emphasized for dynamical modeling for purposes of feedback control.…”

Section: B Modeling For Mems/nems Control 1) Physical Modelsmentioning

confidence: 99%

A Survey of Modeling and Control Techniques for Micro- and Nanoelectromechanical Systems

Ferreira

Aphale

2011

IEEE Trans. Syst., Man, Cybern. C

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Abstract-In the current times, MEMS and NEMS form a major inter-disciplinary area of research involving science, engineering and technology. A lot of work has been reported in the area of modeling and control of these devices, with the aim of better understanding their behavior and improving their performance. This work presents a review of the emerging advances in the modeling and control of these micro-and nanoscale devices and converges on the exciting research in onchip control, with a mechatronics and controls perspective and concludes by projecting future trends.

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“…However, FEA modeling that includes mechanical, electrical, and thermal effects can be time consuming. Alternatively, reduced-order FEA modeling with average temperature as a state variable facilitates simulation for control design [6].…”

Section: Mems Chipmentioning

confidence: 99%