2020
DOI: 10.1016/j.solener.2019.11.095
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Metallization of crystalline silicon solar cells for shingled photovoltaic module application

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Cited by 22 publications
(4 citation statements)
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“…Modules were also fabricated using ptype multicrystalline Si solar cells with an Al back-surface field of 31 × 30 mm 2 . Shingling connections [28][29][30] of the three cells with a 1 mm overlap width were produced using conducting paste. Module bases were made of polycarbonate or polytetrafluoroethylene because preliminary experiments confirmed that a module base made of vinyl chloride was deformed at 85 °C during acceleration testing.…”
Section: Methodsmentioning
confidence: 99%
“…Modules were also fabricated using ptype multicrystalline Si solar cells with an Al back-surface field of 31 × 30 mm 2 . Shingling connections [28][29][30] of the three cells with a 1 mm overlap width were produced using conducting paste. Module bases were made of polycarbonate or polytetrafluoroethylene because preliminary experiments confirmed that a module base made of vinyl chloride was deformed at 85 °C during acceleration testing.…”
Section: Methodsmentioning
confidence: 99%
“…The SEM images are shown in Figure 11. It can be seen from Figure 11 that there were two types of silver nanoparticles on the surface of the silicon layer of the solar cell (Wonje et al, 2020). One was framed by the red circles, which were nano silver microcrystals grown after the reaction of glass with SiN x or silicon.…”
Section: Effect Of Glass Powder On Sintering Properties Of Silver Pastementioning
confidence: 99%
“…Due to the omission of the soldering process, silver soldering tabs are no longer needed in shingled modules. In addition, it is possible to replace conventional busbars with localized Ag pads 90,91 or use busbar-less solar cells in a shingled module, 92,93 especially with SHJ solar cells, of which the conductivity of ITO layers on both sides could also contribute to the current transport between shingles. Therefore, the shingled configuration presents a unique opportunity to considerably reduce the silver consumption in busbars and soldering tabs regions.…”
Section: Prospects For Emerging Module Technologiesmentioning
confidence: 99%