Abstract:The interfaces formed by evaporating copper, nickel, and chromium layers on polystyrene, polyvinyl alcohol, polyethylene oxide, polyvinyl methyl ether, polyvinyl acetate, and poly~ethyl methacrylate have been studied with x-ray photoemission spectroscopy (XPS). The adhesIOn strengths of the metal films to the polymers were measured by a tensile-pull test. At submonolayer coverages of the metals, the peak positions and widths of the metallic electron core levels measured with XPS vary significantly from one pol… Show more
“…[22] However, the conditions of deposition of the metal onto the PDMS surface may influence the characteristics of the deposited film. Studies on the interaction of evaporated Au with a low surface free energy substrate (Teflon AF) revealed a very small condensation coefficient of the incoming Au atoms on the surface.…”
The formation of permanent or reversible metallic patterns on a substrate has applications in microfabrication and analytical techniques. Here, we investigate how to metallize an elastomeric stamp, either for processing of a substrate mediated by the proximity between the metal on the stamp and an active layer on the substrate, or for contact printing of the metal from a stamp to a substrate. The stamps were made from poly(dimethylsiloxane) (PDMS) and were modified before metallizing them with Au by adding to or removing from their bulk mobile silicone residues, by oxidizing their surface with an O2‐plasma, by surface‐fluorination via silanization, or by priming them with a Ti layer. The interplay between the adhesion of the different layers defines two categories of application: contact processing and contact printing. Contact processing corresponds to keeping the metal on the stamp after contacting a substrate; it is reversible and nondestructive, and useful to define transient electrical contacts or quench fluorescence on a surface, for example. Contact printing occurs when the metal on the stamp adheres to the printed surface. Contact printing can transfer a metal, layers of metals, or an oxide onto a substrate with submicrometer lateral resolution. The transfer can be total or localized to the regions of contact, depending on the morphology of the metal on the stamp and/or the surface chemistry of the substrate.
“…[22] However, the conditions of deposition of the metal onto the PDMS surface may influence the characteristics of the deposited film. Studies on the interaction of evaporated Au with a low surface free energy substrate (Teflon AF) revealed a very small condensation coefficient of the incoming Au atoms on the surface.…”
The formation of permanent or reversible metallic patterns on a substrate has applications in microfabrication and analytical techniques. Here, we investigate how to metallize an elastomeric stamp, either for processing of a substrate mediated by the proximity between the metal on the stamp and an active layer on the substrate, or for contact printing of the metal from a stamp to a substrate. The stamps were made from poly(dimethylsiloxane) (PDMS) and were modified before metallizing them with Au by adding to or removing from their bulk mobile silicone residues, by oxidizing their surface with an O2‐plasma, by surface‐fluorination via silanization, or by priming them with a Ti layer. The interplay between the adhesion of the different layers defines two categories of application: contact processing and contact printing. Contact processing corresponds to keeping the metal on the stamp after contacting a substrate; it is reversible and nondestructive, and useful to define transient electrical contacts or quench fluorescence on a surface, for example. Contact printing occurs when the metal on the stamp adheres to the printed surface. Contact printing can transfer a metal, layers of metals, or an oxide onto a substrate with submicrometer lateral resolution. The transfer can be total or localized to the regions of contact, depending on the morphology of the metal on the stamp and/or the surface chemistry of the substrate.
“…The pullup test provides a superior measure of adhesion, in comparison with other methods such as peel testing, for polymer-metal interfaces. [32] In this work, we examine the effect of ATmaP and other flame-based surface-treatment processes on PP surface properties that are relevant to adhesion. XPS and ToF-SIMS are used to examine changes in surface chemistry and pull-up tests are used to characterise adhesion strength.…”
Polypropylene (PP) is used in many automotive applications where good paint adhesion is of primary importance. PP is widely known for its low surface energy which impacts negatively on its adhesion strength. PP surfaces were modified using a new industrial surface-treatment process known as the Accelerated Thermo-molecular adhesion Process (ATmaP). ATmaP grafts functional groups to the polymer surface derived from an atomised and vapourised nitrogen-containing coupling agent. The surface properties and adhesion performance of PP samples treated using the ATmaP process and two different flame processes were compared using XPS, time-of-flight secondary ion mass spectrometry (ToF-SIMS) and mechanical testing (pull-up tests).
“…The peeled-copper foil also showed some characteristics IR peak of polyurethane, such as C¼ ¼O stretching at 1725 cm À1 (free) and 1700 cm À1 (hydrogen bonded). Many researchers have reported that the adhesion strength between polymer and metal could be enhanced significantly by incorporation of nitrogen-or oxygen-containing functionalities into the polymer [30][31][32] ; but this hypothesis is contradicted by the polyurethane/Cu system. Further, chemical treatment of Cu with amino acids or silane solution appeared to be necessary to reach desirable adhesion strength.…”
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