Formation of ohmic contacts to GaN is of high practical importance for device fabrication. Due to the wide band gap, formation of multilayer metal structures is required to make electrical connections with low contact resistance. The paper presents a study on structure, composition, adhesion and electrical properties of Ti/Al/Ti/Au and Ta/Al/Ta metal stacks fabricated by e-beam evaporation and thermal annealing in order to provide ohmic contacts to n-type GaN films grown on Si. For the Ti-based case, an interdiffusion of Au and Ga into the stack is found, which is probably caused by a granular structure of the top Ti layer making no proper barrier. Ti of the bottom layer is observed to diffuse into GaN, forming a thin layer of titanium nitride with a low Schottky barrier at GaN interface allowing ohmic contact as shown by electrical measurements.