Metal micro-hole formation without recast layer by laser machining and electrochemical machining

Sun, Aixi; Chang, Yubo; Liu, Hongjun

doi:10.1016/j.ijleo.2018.06.099

Cited by 21 publications

(5 citation statements)

References 15 publications

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“…Tsao et al [13] studied the mechanism of laser-assisted improvement of chemical etching localization and realized the processing of microgrooves with a width of 2 μm. Sun et al [14] carried out electrochemical machining of laser-processed prefabricated micro holes with tube electrodes. Thus, compared with laser processing, results showed that there was no sputtering on the surface of the material processed by LECM, and there was no recast layer on the side wall of the micro holes.…”

Section: Introductionmentioning

confidence: 99%

Feasibility study of laser and in-situ ECM of array holes

Shao

Yang

Wang

et al. 2022

Seventeenth National Conference on Laser Technology and Optoelectronics

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Aiming at the issues of low machining efficiency and difficulty in keeping consistency of machining accuracy of micro array holes with high surface quality. This paper proposed a laser and in-situ electrolytic machining technology for processing array holes, which utilized the advantages of high laser machining efficiency and good surface quality electrochemical machining (ECM). Firstly, laser was used to perform high-efficiency drilling of prefabricated micro array holes on workpieces that was covered with insulating layer, and then the recast layer and taper of prefabricated holes were removed by ECM. To verify the feasibility of the proposed method, laser prefabricated of the array holes with the diameter of 0.8 mm and the in-situ electrolytic recast layer removal were carried out on the Inconel 718 workpiece. Influences of laser scanning speed, defocusing distance, scanning times and insulating plate thickness on the taper of prefabricated hole were investigated experimentally. The optimized laser processing parameters were as follows: scanning speed 60 mm/s, defocusing distance 1.5 mm, scanning times 50, and insulating plate thickness 0.4mm. Results of in-situ ECM showed that the recast layer on the surface of the laser processed holes could be removed, indicating that the laser and in-situ ECM could achieve high efficiency and high precision machining of micro array holes without recast layer.

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Section: Introductionmentioning

confidence: 99%

Feasibility study of laser and in-situ ECM of array holes

Shao

Yang

Wang

et al. 2022

Seventeenth National Conference on Laser Technology and Optoelectronics

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“…The laser was used to carry out the thermal softening of the hard material while the mechanical interaction between the cutting tool and the workpiece was in progress. Sun et al [23], proposed sequential hybrid micromachining combining LBMM and electrochemical micromachining (EMM). They [23] have successfully managed to remove the recast layer machined holes formed during the LBMM process by the subsequent EMM nishing operation.…”

Section: Introductionmentioning

confidence: 99%

“…Sun et al [23], proposed sequential hybrid micromachining combining LBMM and electrochemical micromachining (EMM). They [23] have successfully managed to remove the recast layer machined holes formed during the LBMM process by the subsequent EMM nishing operation. Some other reported Laser-assisted machining technologies include Laser-assisted turning [24], Laser-assisted milling [25], Laser-assisted waterjet machining [26].…”

Section: Introductionmentioning

confidence: 99%

Effect of laser parameters on sequential laser beam micromachining and micro electro-discharge machining

Rashid

Saleh

Noor

et al. 2021

Int J Adv Manuf Technol

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Laser beam micromachining (LBMM) and micro electro-discharge machining (µEDM) based sequential micromachining technique, LBMM-µEDM has drawn signi cant research attention to utilizing the advantages of both methods, i.e. LBMM and µEDM. In this process, a pilot hole is machined by the LBMM and subsequently nishing operation of the hole is carried out by the µEDM. This paper presents an experimental investigation on the stainless steel (type SS304) to observe the effects of laser input parameters (namely laser power, scanning speed, and pulse frequency) on the performance of the nishing technique that is the µEDM in this case. The scope of the work is limited to 1-D machining, i.e. drilling micro holes. It was found that laser input parameters mainly scanning speed and power in uenced the output performance of µEDM signi cantly. Our study suggests that if an increased scanning speed at a lower laser power is used for the pilot hole drilling by the LBMM process, it could result in signi cantly slower µEDM machining time. On the contrary, if the higher laser power is used with even the highest scanning speed for the pilot hole drilling, then µEDM processing time was faster than the previous case. Similarly, µEDM time was also quicker for LBMMed pilot holes machined at low laser power and slow scanning speed. Our study con rms that LBMM-µEDM based sequential machining technique reduces the machining time, tool wear and instability (in terms of short circuit count) by a margin of 2.5 x, 9 x and 40 x respectively in contrast to the pure µEDM process without compromising the quality of the holes.

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“…Long et al [18] designed a kind of immersed laser-ECM experiment, in which a 0.2 mm thick stainless steel workpiece was immersed in NaCl (0.5 mol l −1 ) solution, it took them 8 min to drill an aspect ratio limited through hole. Sun et al [19] used a conventional tube cathode to remove the laser induced RL, though RL was successfully removed by ECM, their experimental result was far from enough, only some very shallow pits were drilled on the workpiece.…”

Section: Introductionmentioning

confidence: 99%

Removal of recast layer in the laser drilled film cooling holes by a two-step inner streaming electrochemical technique

Duan¹,

Mei²,

Fan³

et al. 2021

J. Micromech. Microeng.

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High-power millisecond laser is an efficient tool to manufacture micro holes, but the laser induced thermal defects, such as recast layer (RL), micro cracks and heat affected zone, are difficult to avoid. However, some important components, like turbine blades, are very sensitive to these defects, therefore, they must be eliminated in the manufacturing process of film cooling holes. We propose a combined processing method which includes high-power laser pre-drilling and electrochemical post-processing. One novelty of this study is that we applied a special back-bonded material (silicate mixture) under the Inconel 718 substrate, which functions as barricade to protect the opposite inner surface of the hollow blade in laser drilling, while in the electrochemical process, it functions as bottom support to form electrolyte back flow. A novel two-step inner streaming electrochemical post-processing technique was designed according to the characteristics of RL distribution in the laser pre-drilled holes. The processing strategy was optimized by a series of experiments. Finally, recast-layer free holes with clear and straight hole walls could be drilled in less than 30 s each, which is much faster than ultrafast laser drilling.

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Metal micro-hole formation without recast layer by laser machining and electrochemical machining

Cited by 21 publications

References 15 publications

Feasibility study of laser and in-situ ECM of array holes

Feasibility study of laser and in-situ ECM of array holes

Effect of laser parameters on sequential laser beam micromachining and micro electro-discharge machining

Removal of recast layer in the laser drilled film cooling holes by a two-step inner streaming electrochemical technique

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