MEMS Technology: A Review

Mishra, Manish; Dubey, Vikas; Mishra, Pushyamitra; Khan, Isharat

doi:10.9734/jerr/2019/v4i116891

Cited by 97 publications

(54 citation statements)

References 88 publications

(98 reference statements)

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“…Microelectromechanical systems (MEMS) are used to create miniature, highly sensitive sensors and actuators that can collect non-electronic information from the physical world such as temperature, barometric pressure, relative humidity, acceleration, vibration [1,2]. This analog information can be digitized and transmitted to a microcontroller for signal processing.…”

Section: Introductionmentioning

confidence: 99%

Displacement Analysis of the MEMS Device

Ertugrul

2020

Metall Mater Eng

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In this study, the displacement analysis of the microelectromechanical system (MEMS) device was performed. The current passing through the microdevice radiates heat energy as it pushes the device to the desired distance through thermal expansion. The amount of expansion varies depending on the current flowing through the device. With the designed model, the amount of current required for the displacement of the MEMS device is determined. In addition, the displacements produced in the microdevice for different metallic materials (silver and gold) and input potentials (0.4 V, 0.8 V, and 1.2 V) were calculated. These types of materials are frequently preferred in MEMS technology due to their high conductivity. Increasing the voltage value as a result of the analysis studies increased the displacement of the materials. When 1.2 V voltage is applied, the highest displacement values for silver and gold are; 6.45 μm, 4.32 μm, respectively. According to the results, the silver material showed a significant displacement compared to gold material.

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Section: Introductionmentioning

confidence: 99%

Displacement Analysis of the MEMS Device

Ertugrul

2020

Metall Mater Eng

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“…Currently, power electronic devices in conversion systems and micro-electromechanical systems (MEMS), such as DC/AC converters, AC/DC converters, DC/DC converters, control, ICs and sensors are mainly manufactured by silicon (Si) material [13]. The performance of Si-based power electronics has almost been driven to its logical boundary after about 60 years of tremendous development, but they still cannot offer satisfactory performance for many applications.…”

Section: Introductionmentioning

confidence: 99%

Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review

Guo

Xun

et al. 2019

Micromachines

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The significant advance of power electronics in today’s market is calling for high-performance power conversion systems and MEMS devices that can operate reliably in harsh environments, such as high working temperature. Silicon-carbide (SiC) power electronic devices are featured by the high junction temperature, low power losses, and excellent thermal stability, and thus are attractive to converters and MEMS devices applied in a high-temperature environment. This paper conducts an overview of high-temperature power electronics, with a focus on high-temperature converters and MEMS devices. The critical components, namely SiC power devices and modules, gate drives, and passive components, are introduced and comparatively analyzed regarding composition material, physical structure, and packaging technology. Then, the research and development directions of SiC-based high-temperature converters in the fields of motor drives, rectifier units, DC–DC converters are discussed, as well as MEMS devices. Finally, the existing technical challenges facing high-temperature power electronics are identified, including gate drives, current measurement, parameters matching between each component, and packaging technology.

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“…MEMS accelerometers are today used in a multitude of fields and are ideal for large-scale and large-volume applications (e.g., monitoring of machines and vehicles, navigation systems, etc.) [5,6,7,8]. Later, boosted by space exploration necessities, sensors became even more lightweight and sensitive, and suitable also for the requirements of earthquake monitoring [9,10].…”

Section: Introductionmentioning

confidence: 99%

“…The increasing capillarity of their diffusion is literally revolutionizing both the industry and the market. A comprehensive list of the variety of possible applications of MEMS devices is given in [8,11]. Schematically, a MEMS device can be defined as a system capable of sensing the external environment and then convert the measured physical quantities into electrical impulses.…”

Section: Introductionmentioning

confidence: 99%

A Review of the Capacitive MEMS for Seismology

D’Alessandro

Scudero

Vitale

2019

Sensors

104

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MEMS (Micro Electro-Mechanical Systems) sensors enable a vast range of applications: among others, the use of MEMS accelerometers for seismology related applications has been emerging considerably in the last decade. In this paper, we provide a comprehensive review of the capacitive MEMS accelerometers: from the physical functioning principles, to the details of the technical precautions, and to the manufacturing procedures. We introduce the applications within seismology and earth sciences related disciplines, namely: earthquake observation and seismological studies, seismic surveying and imaging, structural health monitoring of buildings. Moreover, we describe how the use of the miniaturized technologies is revolutionizing these fields and we present some cutting edge applications that, in the very last years, are taking advantage from the use of MEMS sensors, such as rotational seismology and gravity measurements. In a ten-year outlook, the capability of MEMS sensors will certainly improve through the optimization of existing technologies, the development of new materials, and the implementation of innovative production processes. In particular, the next generation of MEMS seismometers could be capable of reaching a noise floor under the lower seismic noise (few tenths of ng/ H z ) and expanding the bandwidth towards lower frequencies (∼0.01 Hz).

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MEMS Technology: A Review

Cited by 97 publications

References 88 publications

Displacement Analysis of the MEMS Device

Displacement Analysis of the MEMS Device

Silicon Carbide Converters and MEMS Devices for High-temperature Power Electronics: A Critical Review

A Review of the Capacitive MEMS for Seismology

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