MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics

Amón, Cristina H.; Murthy, Jayathi Y.; Yao, Shi‐Chune; Narumanchi, Sreekant; Wu, C. F.; Hsieh, Cheng-Yu

doi:10.1016/s0894-1777(01)00071-1

Cited by 106 publications

(34 citation statements)

References 25 publications

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“…Nowadays, it is very well-known that an increment in the capacity and reduction size of electronic equipment produces higher heat transfer rates than before [2,3]. Phelan and others [4] made a review study about different and nonconventional refrigeration systems; concluding that only TECs can meet the requirements imposed by the electronic miniaturization and to be commercially available.…”

Section: Thermoelectric Studiesmentioning

confidence: 99%

Entropy Generation Minimization of a Thermoelectric Cooler

Gutiérrez¹,

Méndez

2008

TOTHERJ

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Abstract:In the present work, we develop a theoretical analysis to minimize the entropy generation of a thermo-electric cooler (TEC), which can be used to cool a processor. We have applied an analysis of first and second law of the Thermodynamics to a TEC. We consider the entropy generation equation as the objective function and the first law as a restriction, in accordance with the variational calculus theory. The numerical predictions show that minimum entropy generation and the better performance coefficients (COPs) are achieved with the largest figure of merit, which represents a relationship between the Peltier effect (cooling) and the Joule effect (heating).

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Section: Thermoelectric Studiesmentioning

confidence: 99%

Entropy Generation Minimization of a Thermoelectric Cooler

Gutiérrez¹,

Méndez

2008

TOTHERJ

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“…Novel orifice shapes used in conjunction with surface enhancements were investigated for microsized evaporative spray nozzles [4,5], but have received little attention in the two-phase jet impingement literature. For single-phase confined impinging jets, small jet orifice lengths (l/d < 1) resulted in higher heat transfer coefficients compared to longer orifices [6].…”

Section: Introductionmentioning

confidence: 99%

Local single- and two-phase heat transfer from an impinging cross-shaped jet

Rau¹,

Dede²,

Garimella³

2014

International Journal of Heat and Mass Transfer

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“…Many emerging technologies with higher transistor integration densities, such as microwave systems, defense laser, modern electronics and power devices, have increased the chip level heat fluxes to more than 100 W/cm 2 [1]. As a traditional cooling technology, air cooling cannot adequately satisfy such high-flux heat removal and will have to be replaced or supplemented by other effective cooling solutions.…”

Section: Introductionmentioning

confidence: 99%

Experimental study of the effects of structured surface geometry on water spray cooling performance in non-boiling regime

et al. 2010

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Experiments were conducted to study the effects of enhanced surfaces on heat transfer performance during water spray cooling in non-boiling regime. The surface enhancement is straight fin. The structures were machined on the top surface of heated copper blocks with a cross-sectional area of 10 mmÂ10 mm. The spray was performed using Unijet full cone nozzles with a volumetric flux of 0.044-0.053 m 3 /(m 2 $s) and a nozzle height of 17 mm. It is found that the heat transfer is obviously enhanced for straight fin surfaces relative to the flat surface. However, the increment decreases as the fin height increases. For flat surface and enhanced surfaces with a fin height of 0.1 mm and 0.2 mm, as the coolant flux increases, the heat flux increases as well. However, for finned surface with a height of 0.4 mm, the heat flux is not sensitive to the coolant volumetric flux. Changed film thickness and the form of water/surface interaction due to an enhanced surface structure (different fin height) are the main reasons for changing of the local heat transfer coefficient.

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MEMS-enabled thermal management of high-heat-flux devices EDIFICE: embedded droplet impingement for integrated cooling of electronics

Cited by 106 publications

References 25 publications

Entropy Generation Minimization of a Thermoelectric Cooler

Entropy Generation Minimization of a Thermoelectric Cooler

Local single- and two-phase heat transfer from an impinging cross-shaped jet

Experimental study of the effects of structured surface geometry on water spray cooling performance in non-boiling regime

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