The recent finding of large electrocaloric effect in several ferroelectric polymers creates unique opportunity for developing compact size solid state cooling cycles beyond the traditional mechanical vapor compression cycles. Here, we show that, by employing regeneration process with solid state regenerators, a chip scale Electrocaloric Oscillatory Refrigeration (ECOR) can be realized. A prototype ECOR is fabricated and characterized. More than 6 K temperature span is obtained near room temperature between the hot and cold sides of a 2 cm long device. Finite volume simulation validates the test results and shows the potential high performance of the ECOR.

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Heat-transfer augmentation by straight grid spacers in rod bundles is studied for single-phase flow and for post-critical heat flux dispersed flow. The heat transfer effect of swirling grid spacers in single-phase flow is also examined. Governing heat-transfer mechanisms are analyzed, and predictive formulations are established. For single-phase flow, the local heat transfer at a straight spacer and at its upstream or downstream locations are treated separately. The effect of local velocity increasing near swirling spacer is considered. For post critical heat flux (CHF) dispersed flow, the heat transfer by thermal radiation, fin cooling, and vapor convection near the spacer are calculated. The predictions are compared with experimental data with satisfactory agreement.