MEMS-Based Probe Array for Wafer Level LSI Testing Transferred onto Low CTE LTCC Substrate by Au/Sn Eutectic Bonding

Choe, Seong-Hun; Tanaka, Shinya; Esashi, M.

doi:10.1109/sensor.2007.4300683

Cited by 9 publications

(6 citation statements)

References 2 publications

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“…Three-dimensional (3D) metallic microstructures are in demand for practical applications, such as high density semiconductor probes [1], neural probe arrays [2], and bio-molecule probes [3,4]. The previous electroplating process [4,5], used for 3D metallic microstructure fabrication, is complex, expensive, and time consuming.…”

Section: Introductionmentioning

confidence: 99%

A multi-step electrochemical etching process for a three-dimensional micro probe array

Kim

Youn

Cho

et al. 2010

J. Micromech. Microeng.

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We present a simple, fast, and cost-effective process for three-dimensional (3D) micro probe array fabrication using multi-step electrochemical metal foil etching. Compared to the previous electroplating (add-on) process, the present electrochemical (subtractive) process results in well-controlled material properties of the metallic microstructures. In the experimental study, we describe the single-step and multi-step electrochemical aluminum foil etching processes. In the single-step process, the depth etch rate and the bias etch rate of an aluminum foil have been measured as 1.50 ± 0.10 and 0.77 ± 0.03 μm min −1 , respectively. On the basis of the single-step process results, we have designed and performed the two-step electrochemical etching process for the 3D micro probe array fabrication. The fabricated 3D micro probe array shows the vertical and lateral fabrication errors of 15.5 ± 5.8% and 3.3 ± 0.9%, respectively, with the surface roughness of 37.4 ± 9.6 nm. The contact force and the contact resistance of the 3D micro probe array have been measured to be 24.30 ± 0.98 mN and 2.27 ± 0.11 , respectively, for an overdrive of 49.12 ± 1.25 μm.

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Section: Introductionmentioning

confidence: 99%

A multi-step electrochemical etching process for a three-dimensional micro probe array

Kim

Youn

Cho

et al. 2010

J. Micromech. Microeng.

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show abstract

“…54,58 One of the drawbacks of solid, metal-based micro-contactors probes is that the smaller the probe needle gets, the more force they exert per area, causing unwanted damage to micro solder balls or leaving behind scrub marks, as in the case of MEMS cantilever probes. 67,68 Therefore, CNT-based micro-contact probes' with "low-…”

Section: Resultsmentioning

confidence: 99%

Carbon nanotube micro-contactors on ohmic substrates for on-chip microelectromechanical probing applications at wafer level

Tas

Baker

Musaramthota

et al. 2019

Carbon

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“…Then the Si 3 N 4 /SiO 2 (100 nm/150 nm) layer is patterned to be the etching mask. XeF 2 isotropic dry etching is used to remove the silicon substrate underneath the PZT structure [26]. The etching rate of the XeF 2 gas is 1 µm min −1 .…”

Section: Resultsmentioning

confidence: 99%

“…For large adhesion between the PZT particles and the photoresist, figure 5(a) shows undesirable PZT layers deposited at the photoresist sidewalls. Although Zhao et al has reported a process using SU-8 lift-off to fabricate thick PZT film structures [25], it is also known that SU-8 is difficult to strip after being UV exposed [26]. Accordingly, the photoresist KMPR-1050 has been invented by MicroChem Corp. to replace SU-8 for the lift-off process [26].…”

Section: Fabrication Of Pzt Microstructuresmentioning

confidence: 99%

“…Although Zhao et al has reported a process using SU-8 lift-off to fabricate thick PZT film structures [25], it is also known that SU-8 is difficult to strip after being UV exposed [26]. Accordingly, the photoresist KMPR-1050 has been invented by MicroChem Corp. to replace SU-8 for the lift-off process [26]. However, the sidewalls of the photoresist KMPR-1050 peel off the undesirable PZT layers, causing the damage around the edge of the PZT patterns as illustrated in figures 5(b) and (c).…”

Section: Fabrication Of Pzt Microstructuresmentioning

confidence: 99%

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The fabrication of silicon-based PZT microstructures using an aerosol deposition method

Wang

Lee

et al. 2008

J. Micromech. Microeng.

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This paper presents a series of processes for fabricating lead-zirconate-titanate (PZT) microstructures on a silicon substrate. An aerosol deposition method was used to deposit PZT thick film at room temperature. The low temperature deposition enabled a special lift-off process for patterning thick PZT films using a THB-151N photoresist. The milling rate of THB-151N by PZT particles was found to be the same as the PZT deposition rate of 5 µm h −1 . Using this patterning technique, complex configurations of PZT microstructures have been demonstrated. Suspended multi-layer PZT microstructures have also been realized in this work.

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MEMS-Based Probe Array for Wafer Level LSI Testing Transferred onto Low CTE LTCC Substrate by Au/Sn Eutectic Bonding

Cited by 9 publications

References 2 publications

A multi-step electrochemical etching process for a three-dimensional micro probe array

A multi-step electrochemical etching process for a three-dimensional micro probe array

Carbon nanotube micro-contactors on ohmic substrates for on-chip microelectromechanical probing applications at wafer level

The fabrication of silicon-based PZT microstructures using an aerosol deposition method

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