MEMS actuators and sensors: observations on their performance and selection for purpose

Abstract

This paper presents an exercise in comparing the performance of microelectromechanical systems (MEMS) actuators and sensors as a function of operating principle. Data have been obtained from the literature for the mechanical performance characteristics of actuators, force sensors and displacement sensors. On-chip and off-chip actuators and sensors are each sub-grouped into families, classes and members according to their principle of operation. The performance of MEMS sharing common operating principles is compared with each other and with equivalent macroscopic devices. The data are used to construct performance maps showing the capability of existing actuators and sensors in terms of maximum force and displacement capability, resolution and frequency. These can also be used as a preliminary design tool, as shown in a case study on the design of an on-chip tensile test machine for materials in thin-film form.

Wafer-level mechanical and electrical integration of SMA wires to silicon MEMS using electroplating

“…The fabricated actuators showed high performance in terms of deflection and stroke, with displacements among the highest reported for actuators of comparable size [11].…”

Survey on Recent Designs of Compliant Micro-/Nano-Positioning Stages

“…Therefore, they are widely used with compliant mechanisms in the field of micro-/nano-positioning. Furthermore, a detailed survey about the performance and selection of actuators can be found in [19].…”

Integrated Magnetic MEMS Relays: Status of the Technology

“…Apart from the obvious difficulties in terms of IC integration, high actuation voltages decrease the lifetime of the devices by increasing charge trapping in the dielectric layers [40][41][42][43] Reliability is a crucial requirement to enable the successful application of novel MEMS devices [12,23,40,48,49], and studies have been conducted to investigate the lifetime of MEMS switches in a variety of conditions, such as in hot switching operation [50] or under different temperature regimes [51], among others. As reported by Rebeiz, the failure mechanisms generally observed in MEMS switches are not related to mechanical damage in the anchor region of the movable components [12], as the displacement gaps (in the range of few µm, as seen in all the reviewed devices) are considerably smaller than the typical overall dimensions of the moveable structures (in the range of 50-500 µm).…”