Emerging Nanoelectronic Devices 2014
DOI: 10.1002/9781118958254.ch12
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Cited by 6 publications
(5 citation statements)
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“…The sneak path problem is one of the main concerns in the construction of three-dimensional (3D) crossbar memory using BRS. , Here, the cross-talk interference between adjacent cells caused by sneak path current may result in misleading information . Several solutions have been suggested to overcome the sneak path problem, such as volatile switch, threshold switch, nonlinear device, diode-based solutions, etc. , Linn et al suggested the most effective way to resolve the sneak path problem, where two RS devices are connected antiserially so that if one device possesses LRS, then the other device is in HRS . Such a system is known as complementary resistive switching (CRS) .…”
Section: Introductionmentioning
confidence: 99%
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“…The sneak path problem is one of the main concerns in the construction of three-dimensional (3D) crossbar memory using BRS. , Here, the cross-talk interference between adjacent cells caused by sneak path current may result in misleading information . Several solutions have been suggested to overcome the sneak path problem, such as volatile switch, threshold switch, nonlinear device, diode-based solutions, etc. , Linn et al suggested the most effective way to resolve the sneak path problem, where two RS devices are connected antiserially so that if one device possesses LRS, then the other device is in HRS . Such a system is known as complementary resistive switching (CRS) .…”
Section: Introductionmentioning
confidence: 99%
“…28 Several solutions have been suggested to overcome the sneak path problem, such as volatile switch, threshold switch, nonlinear device, diode-based solutions, etc. 29,30 Linn et al suggested the most effective way to resolve the sneak path problem, where two RS devices are connected antiserially so that if one device possesses LRS, then the other device is in HRS. 31 Such a system is known as complementary resistive switching (CRS).…”
Section: ■ Introductionmentioning
confidence: 99%
“…The change of the memristor resistance is represented by the x(t) variable in Eq. (2). The speed of change of the boundary between the un-doped and doped layers is stated by dx / dt in Eq.…”
Section: Linear Drift Model and Window Functions Of The Memristormentioning
confidence: 99%
“…RESENT MEMORY Technologies such as Dynamic Random Access Memory (DRAM), Static Random Access Memory (SRAM), NAND flash and NOR flash will soon encounter challenges due to the continued scaling down of their designs [1]. Several types of memory technologies have been suggested for next generation memory devices including Spin-Transfer Torque RAM (STT-RAM), Phase Change Memory (PCM) and Resistive RAM (ReRAM) [2]. Researchers have focused on the Resistive Random Access Memory (RRAM) because of its ultra-high density production potential, faster switching speed and lower energy consumption for non-volatile memory applications.…”
Section: Introductionmentioning
confidence: 99%
“…The high processing temperature of the transistors makes it almost impossible to be used in 3D stacked memories. So the best approach to solve the sneak path problem is to use two-terminal thin-film-based selector devices that can be scaled laterally and stacked vertically together with a memristor (Chen, 2015;Burr et al, 2016).…”
Section: Introductionmentioning
confidence: 99%