Melamine foam-supported 3D interconnected boron nitride nanosheets network encapsulated in epoxy to achieve significant thermal conductivity enhancement at an ultralow filler loading

Wang, Xiongwei; Wu, Peiyi

doi:10.1016/j.cej.2018.04.196

Cited by 178 publications

(77 citation statements)

References 59 publications

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“…For instance, Zeng et al developed an ice‐templated fabrication method, which produces an ordered 3D honeycomb‐like network ( Figure a). Wang and Wu proposed to fabricate 3D BNNS network via multiple layer‐by‐layer assembly using 3D melamine foam (MF) (Figure b) . Through a two‐step CVD method, Xue et al synthesized a BN cellular architecture made of interconnective nanotubular hBN (Figure c) …”

Section: Polymer Composites With Nanostructured Fillers For High Thermentioning

confidence: 99%

Section: Polymer Composites With Nanostructured Fillers For High Thermentioning

confidence: 99%

“…g) Polymer composites with 3D nanostructures, including melamine foam with BN nanosheets assemblies (22, ref. ), 3D BN cellular architecture (23, ref. ), polystyrene composite with 3D segregated double networks (24, ref.…”

Section: Introductionmentioning

confidence: 99%

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Thermal Transport in 3D Nanostructures

Zhan

Nie

Chen

et al. 2019

Adv Funct Materials

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This work summarizes the recent progress on the thermal transport properties of 3D nanostructures, with an emphasis on experimental results. Depending on the applications, different 3D nanostructures can be prepared or designed to either achieve a low thermal conductivity for thermal insulation or thermoelectric devices or a high thermal conductivity for thermal interface materials used in the continuing miniaturization of electronics. A broad range of 3D nanostructures are discussed, ranging from colloidal crystals/assemblies, array structures, holey structures, hierarchical structures, to 3D nanostructured fillers for metal matrix composites and polymer composites. Different factors that impact the thermal conductivity of these 3D structures are compared and analyzed. This work provides an overall understanding of the thermal transport properties of various 3D nanostructures, which will shed light on the thermal management at nanoscale.

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Section: Polymer Composites With Nanostructured Fillers For High Thermentioning

confidence: 99%

Section: Polymer Composites With Nanostructured Fillers For High Thermentioning

confidence: 99%

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Thermal Transport in 3D Nanostructures

Zhan

Nie

Chen

et al. 2019

Adv Funct Materials

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“…However, the high thermal interface resistance between randomly distributed fillers limits the further improvement of thermal conductivity of composites. Other approaches are to construct the efficient thermally conductive filler structure in the composites by using special processing methods, such as segregated structure [16,17], thermal template [18][19][20] and single or double continuous structure [21,22], etc. Nevertheless, the complicated processes of these methods are not conducive to the applications in large-scale fabrication.…”

Section: Introductionmentioning

confidence: 99%

Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network

Gao

Shen

Wang

2020

Mater. Res. Express

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A cost-efficient and practical strategy was developed for preparing high thermal conductive epoxy packaging composites. The effective conductive network was constructed by the bridging effect between boron nitride (BN) and spherical silica (SiO 2 ). Compared to the epoxy (EP) composites with randomly dispersed BN and SiO 2 , the EP/SiO 2 @BN showed a great enhancement in thermal conduction. The thermal conductivity of EP/SiO 2 @BN reached to 0.86 Wm −1 K −1 with 60 wt% content of hybrid filler, which was 91% higher than that of EP/SiO 2 samples and was around 12% higher than that of epoxy composites with unmodified BN and SiO 2 . In addition, the EP/SiO 2 @BN exhibited lower thermal interface resistance in comparison with EP/SiO 2 &BN composites according to the effective medium theory (EMT). The encapsulation of BN on the surface of SiO 2 greatly enhanced the thermal transfer efficiency of the epoxy matrix and showed great potential in the epoxy packaging practical application.

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“…However, the electrical insulation performance of materials by using these conductive fillers will be greatly deteriorated, leading to the limited application as respect of microelectronics devices . Therefore, Ceramic fillers, for example, boron nitride (BN) which possesses high electrical resistance and ideal dielectric property is selected to be suitable thermal conductive fillers in consideration of effective heat dissipation and electronically insulating property. It is well known that a polymer composite filled with a large amount of thermal conductive fillers can construct well‐developed thermal conductive pathway .…”

Section: Introductionmentioning

confidence: 99%

Simultaneously enhancing the thermal conductivity and dielectric constant of BN/CF hybrid filled polypropylene/polystyrene composites via in situ reactive processing

Jiang

Zhou

et al. 2019

Polymer Composites

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Thermal conductive and electrical insulating polymer composites are exerted a tremendous fascination on the field of thermal management. The effective utilization of fillers is indispensable to construct the thermal conductive pathway to fabricate high thermal conductive polymer composites. Herein, a facile approach involves selective localization of boron nitride (BN) and carbon fiber (CF) through in situ polymerization of styrene through reactive processing as well as double‐percolation structure design. These composites can be easily fabricated by blending the BN, CF with polystyrene during the polymerization of styrene monomer and secondary compounding with polypropylene (PP). The selective localization of BN and CF was observed by scanning electron microscope (SEM) characterization. The cocontinuous structure of PP/PS was also confirmed by SEM observation. The thermal conductivity values was promoted from 0.22 W/mk for PP/PS blends to 0.62 W/mk for the in situ reactive blending composites with 14.5 wt% BN and 18 wt% CF. Moreover, the dielectric properties were also higher than that of the simple melt blending composites. Therefore, the method we proposed provides a potentially feasible plan to design and prepare the thermal conductive and electrical insulating composites for thermal management applications.

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Melamine foam-supported 3D interconnected boron nitride nanosheets network encapsulated in epoxy to achieve significant thermal conductivity enhancement at an ultralow filler loading

Cited by 178 publications

References 59 publications

Thermal Transport in 3D Nanostructures

Thermal Transport in 3D Nanostructures

Enhanced thermal conductivity for traditional epoxy packaging composites by constructing hybrid conductive network

Simultaneously enhancing the thermal conductivity and dielectric constant of BN/CF hybrid filled polypropylene/polystyrene composites via in situ reactive processing

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