Mechatronic Applicator for Dispersion Adhesives

Abstract

The article presents the operation and structure of a dispersion adhesive applicator dedicated for printing industry. Contrary to the currently used solutions in which the length of the glue layer is defined by the geometry of the glue roller, the original device enables free formation of the relation between the bonding area and adhesive-free areas. Based on the analysis of geometrical and time dependencies characterising the designed device, a mechatronic control system was developed to enable repeated glue application synchronised with the markers commonly used in printing industry and applied onto the paper. Constructed based on a programmable PLC controller, the system has control over all crucial technological parameters of the process (temperature, glue amount, beginning and end of the bonding area). The user-device communication is interactive, and therefore an additional user panel (touch-screen) is employed. The developed solution was used for applying dispersion adhesives in a technological line for producing multilayer ID cards with RFID labels.

Thermography Testing of a Test Stand for Determining the Efficiency of Heat Recuperators

“…The camera detector was an uncooled microbolometer array with a resolution of 320x240 pixels. According to the methodology of prototype tests developed at the ITeE-PIB, the test object was subject to structural and functional decomposition into subunits, elements, and modules [11,12,13]. Functions and parameters that should be met by the properly operating system were assigned to the tested system, and then functional modules, which can constitute a potential source of inefficiencies, were assigned to those functions and parameters (Fig.…”

Device for Low-Cost Assembly of Chips in RFID Inlays

“…Meeting the requirements of customers and ensuring a constant high level of product quality means that the manufacturers of IDs need to verify their products [5,6] that are in preparation for their implementation, and they are obliged to develop new and better products with increased levels of security [7,8]. It is therefore necessary for the manufacturers to be in the possession of the proper equipment for the experimental and low-cost production of the RFID inlays and the execution of the R&D activity in this field [9,10,11,12,13].…”