Abstract:Increasing challenges are faced to ensure moldability with rapid advances in flip chip technology such as decreasing bump pitch and stand-off height, especially when commercial Moldable Underfill (MUF) is used. The conventional way to detect the voids is to use C-Scan or Thru-Scan to acquire the voids shape and location after MUF process. The whole MUF process is like a black box and the mechanism of the voids formation is unknown. However, in our study Ansys Fluent commercial software was used to track the tr… Show more
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