Advanced Packaging

Lau, John H.

doi:10.1007/978-981-16-1376-0_1

Cited by 8 publications

(7 citation statements)

References 83 publications

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“…Higher processing precision is required for flexible integrated circuit (IC) packaging substrates, substrate-like boards, and IC carriers used in aerospace, communication, consumer electronics, automotive electronics, and defense industries. 1,2 Manufacturing high-density IC substrates belongs to the semiconductor industry and involves three major areas: semiconductor chip fabrication, printed circuit board (PCB) manufacturing, and packaging technology. 3 It includes critical processes such as exposure lithography, copper electroplating, differential etching of copper, and forming.…”

Section: Introductionmentioning

confidence: 99%

A differential geometry-based method for detecting etching defects in high-density interconnect IC substrates

Yu,

Huang,

Zhou

et al. 2023

First Advanced Imaging and Information Processing Conference (AIIP 2023)

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Section: Introductionmentioning

confidence: 99%

A differential geometry-based method for detecting etching defects in high-density interconnect IC substrates

Yu,

Huang,

Zhou

et al. 2023

First Advanced Imaging and Information Processing Conference (AIIP 2023)

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“…For example, in Larnbilly et al 58 . it is said that “the cost of MEMS packaging typically accounts for 75% or more of the sale price of the device” and John et al 59 . estimate that “the packaging cost of MEMS products in general is about 70%.” In our case, a biocompatible package transparent to microwaves in the antenna area, but which acts as a Faraday cage in the micromotor part is a real challenge.…”

Section: Introductionmentioning

confidence: 99%

Model‐based systems engineering approach to the study of electromagnetic interference and compatibility in wireless powered microelectromechanical systems

Martinez‐Rojas,

Fernandez‐Sanchez,

Fernandez‐Munoz

et al. 2023

Systems Engineering

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Electromagnetic Interference and Compatibility (EMI–EMC) are a serious problem in Microelectromechanical Systems (MEMS), and specially in powered by wireless energy transfer MEMS. Most MEMS have dimensions in the order of 1 mm or less, thus, most of the suitable electromagnetic radiation sources have wavelengths larger than this, making isolation of electromagnetic effects very difficult. Model‐Based Systems Engineering (MBSE) can be an excellent tool to deal with EMI—EMC in MEMS during early design phases. In this work, we present a problem‐solving procedure and integration of EMI—EMC in MEMS from a Model‐Based Systems Engineering perspective. This approach is described in detail by a real example using a procedure based on nine steps fully integrated with the proposed systems engineering methodology. For example, the use of context diagrams (IBDs) and N SQUARE charts to describe EMC interactions is explained in detail. The system is formed by a Wireless Power Transfer (WPT) subsystem working near 2.45 or 4.5 GHz coupled to an electromagnetic micromotor. This micromotor contains copper microcoils which can receive electromagnetic radiation directly at the same time that the WPT subsystem. The greatest difficulty is, then, to power the WPT while isolating the micromotor, and optimizing the coupling interface. A summary of the most important EMC concepts and tools are reviewed from the systems engineer perspective and possible problems during the design and testing phases are discussed in detail using the example.

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“…is necessary. With respect to the electrical performance of insulation materials, low-loss Df (dissipation factor or loss tangent) and Dk (dielectric constant or permittivity) materials are highly preferred for 5G applications [ 10 , 11 ]. The recent results of the preparation and investigation of substituted ferrites, promising for microwave applications, have been published in [ 12 , 13 ].…”

Section: Introductionmentioning

confidence: 99%

“…The dielectric loss is proportional to the frequency, Df, and the square root of Dk. Thus, in order to achieve lower transmission loss, lower values of Df and Dk are needed [ 2 , 10 , 16 , 17 ].

where

…”

Section: Introductionmentioning

confidence: 99%

Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications

Lee

Lau

et al. 2022

Materials

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In this study, the Df (dissipation factor or loss tangent) and Dk (dielectric constant or permittivity) of the low-loss dielectric material from three different vendors are measured by the Fabry–Perot open resonator (FPOR) technique. Emphasis is placed on the sample preparation, data collection, and the comparison with the data sheet values provided from vendors. A coplanar waveguide with ground (CPWG) test vehicle with one of these raw dielectric materials (vendor 1) is designed (through Polar and simulation) and fabricated. The impedance of the test vehicle is measured by TDR (time-domain reflectometer), and the effective Dk of the test vehicle is calculated by the real cross-section of the metal line width, spacing, and thickness of the test vehicle and a closed-form equation. In parallel, the insertion loss and return loss are measured with the VNA (vector network analyzer) of the test vehicle. Finally, the measurement and simulation results are correlated. Some recommendations on the low-loss dielectric materials of the Dk and Df are also provided.

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Advanced Packaging

Cited by 8 publications

References 83 publications

A differential geometry-based method for detecting etching defects in high-density interconnect IC substrates

A differential geometry-based method for detecting etching defects in high-density interconnect IC substrates

Model‐based systems engineering approach to the study of electromagnetic interference and compatibility in wireless powered microelectromechanical systems

Characterization of Low-Loss Dielectric Materials for High-Speed and High-Frequency Applications

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