Mechanics of Film Adhesion: Elastic and Elastic-Plastic Behavior

Abstract

A peel test is a useful method for comparing the behavior of various adherends and adhesives. An exact analysis of the mechanics of the peel test would be of great help in the interpretation of test results in terms of the bulk properties of the materials, and of the failure mechanism of the bond. The existing theories of peeling apply to elastic peel films, very thin elastic or viscoelastic adhesive, and a rigid substrate. In many applications the film is metallic, stressed beyond its elastic range; the elasticity of the substrate is often similar to that of the adhesive; and the adhesive may be quite thick compared to the film, or may be wholly absent as in electroplated components. In this paper, the effects of non-elastic behavior of the film are analyzed. Results from the use of computer programs that incorporate an analytical model of steady state peeling are presented and compared with experimental data.

The mechanics and physics of thin film decohesion and its measurement

“…It was originally developed by the aerospace industry as a quality control measure for laminated structural components [46]. More recently, the test has been embraced by the electronics industry to assess the adhesion of metallic and polymeric thick films, deposited on various dielectric substrates [47,48]. The test has the attribute that the peeling force is measured in steadystate, when the shape of the strip remains invariant.…”

Silicone-based adhesives for long-term skin application: cleaning protocols and their effect on peel strength

“…Peeling is the most commonly observed mode of adhesive bond failure [16]. The peel force or peel adhesion, which is applied to rupture the adhesive bond [17], is often used as an index of bond quality.…”

“…The peel force or peel adhesion, which is applied to rupture the adhesive bond [17], is often used as an index of bond quality. This force can be quantified by performing a controlled peel test that is conducted by pulling the adhesive at a constant rate from a know substrate [16]. Many factors have been reported to influence peel force, including peel rate, peel angle, contact pressure, property of the substrate, withdrawal speed, temperature, and humidity of the environment [18].…”

Enhancing the performance of the T-peel test for thin and flexible adhered laminates

“…Chen et al [27] were the first to consider the elastic-plastic behavior in peeling but used the tensile strength criterion for modeling the adhesive failure. Chang et al [28] considered an elastic-perfectly plastic analysis for adhesive failure, and accounted for the energy dissipation during plastic bending.…”