2015
DOI: 10.1016/j.mseb.2015.03.011
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Mechanically enhanced p- and n-type Bi2Te3-based thermoelectric materials reprocessed from commercial ingots by ball milling and spark plasma sintering

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Cited by 79 publications
(49 citation statements)
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“…15,19,30 As mentioned above, the carrier concentration decreased when textured at low temperatures (673 and 733 K) but exhibited an increasing trend at higher texturing temperature (773 K). For Bi 2 (TeSe) 3 polycrystals, significant attention should be paid to the donor-like effect induced from mechanical deformation: 31 2V Bi 000 þ 3V ::…”
Section: Thermoelectric Propertiesmentioning
confidence: 63%
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“…15,19,30 As mentioned above, the carrier concentration decreased when textured at low temperatures (673 and 733 K) but exhibited an increasing trend at higher texturing temperature (773 K). For Bi 2 (TeSe) 3 polycrystals, significant attention should be paid to the donor-like effect induced from mechanical deformation: 31 2V Bi 000 þ 3V ::…”
Section: Thermoelectric Propertiesmentioning
confidence: 63%
“…The ZT enhancement is also remarkable when compared with commercial n-type Bi 2 (TeSe) 3 ingots, whose maximum ZT was measured to be o0.9 in our previous work. 15 Although higher ZT values have been reported for p-type (BiSb) 2 Te 3 polycrystals, the present work has achieved a highly improved performance of n-type Bi 2 (TeSe) 3 alloys, which is required for high-efficiency thermoelectric modules. Figure 9b further presents the ZT max (gray columns) as well as the parameter (μ H /κ l )(m*/m 0 ) 3/2 (blue circles), which is proportional to the thermoelectric efficiency, 14 when compared with the ingots prepared by zone melting (red column) 15 and Bridgman methods (green column) 39 and with the ZT values of the textured samples.…”
Section: Thermoelectric Propertiesmentioning
confidence: 72%
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“…Therefore, the goal of upshifting the service temperature in this work is translated into how to conduct intrinsic point defect engineering via extrinsic Sb and In doping. 13,[32][33][34] Intrinsic point defects are primarily entropic defects. They are thermally more robust than extrinsic point defects and therefore favor robust high-temperature performance.…”
Section: Introductionmentioning
confidence: 99%