Mechanically Compliant Thermal Interfaces Using Biporous Copper‐Polydimethylsiloxane Interpenetrating Phase Composite

Abstract

Thermal interface materials are essential for thermal management in electronics packaging by providing a low resistance thermal pathway between heat sources and heat sinks. Nanostructured materials can be potential candidates for the next‐generation interface materials by coupling their high thermal conductivity and mechanical compliance, suppressing failure even after large numbers of thermal cycles. This work investigates the thermal and mechanical characteristics of a new type of thermal interface materials, consisting of metal/elastomer interpenetrating phase composites. The 3D, highly porous copper scaffolds are fabricated via a fast and simple in situ bubble‐templated electrodeposition process without the presence of solid templates; subsequently, the void fraction of the composite is filled by elastomer infiltration. The presence of elastomer matrix demonstrates limited impact on the thermal conductivity of the composite while it contributes substantially to the mechanical properties, providing the structural flexibility required. Thermal resistance values of 1.2–4.0 cm2 K W–1 are measured upon multiple thermal cycles, confirming the mechanical stability of the composite, without showing any noticeable degradation.

Significantly Enhanced Conformal Contact by the Functional Layers on a Copper Film for Thermal Interface Materials

“…[44] Figure 4h compares the R t and κ of CuMWNTPEG-CuFilm-CuMWNTPEG (red solid star) and AlNPEVA-CuFilm-AlNPEVA (blue solid star) with those of pad-type TIMs in literature. [11,23,[45][46][47][48][49][50][51][52][53] Only pad-type TIMs with R t and κ information are selected for graph comparison. More detailed information is provided in Table S2, Supporting Information.…”

“…Half-filled pink triangle (TIM A) and half-filled gray left-pointing triangle (TIM B) are commercial TIMs [11]. Olive open circle,[11] orange open triangle,[23] black open square,[45] green open circle,[46] blue open triangle,[47] dark yellow open right-pointing triangle,[48] navy open hexagon,[49] purple open pentagon,[50] purple open square,[51] magenta open left-pointing triangle,[52] and black open right-pointing triangle [53]. .…”

The evolution from surface‐ to bubble dynamics‐dominant growth mechanisms of synchronized bubble‐templated microporous copper

“…Three‐dimensional (3D) porous structures are essential components for microelectromechanical systems (MEMs), biofluids, battery electrodes, or heat transfer devices owing to their unique property sets combining high liquid permeability, large accessible surface area, or porosity for secondary material infiltration 1–8 . Templated electrodeposition is the most typical strategy to fabricate 3D porous metal structures 9–11 by using sacrificial templates, which are dissolved by chemicals after fabrication and then form the vacancies of the porous structure.…”