Significantly Enhanced Conformal Contact by the Functional Layers on a Copper Film for Thermal Interface Materials
Mohamad Alayli,
Taehun Kim,
Seongsu Cheon
et al.
Abstract:Low‐cost thermal interface materials with high thermal conductivity (κ) and low total thermal resistance (Rt) receive considerable attention for thermal management. A copper film (CuFilm) is an excellent candidate due to the high κ (364 Wm−1 K−1) it possesses. However, the practical implementation is hindered by its high elastic modulus (Es = 70.8 GPa), inducing a high contact thermal resistance (Rc = 91.6 mm2 K W−1). Herein, the selective construction of electrically conducting or insulating layers on CuFilm … Show more
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