2014
DOI: 10.1080/15567265.2014.948233
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Mechanical Strain Dependence of Thermal Transport in Amorphous Silicon Thin Films

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Cited by 15 publications
(6 citation statements)
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“…A 8% tensile strain reduced the thermal conductivity of pristine MoS 2 by 35% . However, it was also reported that tensile strain resulted in an increase in the thermal conductivity of amorphous silicon thin films, polymer chains, and silicene. , Therefore, the effect of mechanical strain on the thermal conductivity of MoS 2 needs to be studied in detail, in particular, in the presence of defects, as the work on the combined effect of stain and defects on the thermal conductivity of materials is still lacking.…”
Section: Resultsmentioning
confidence: 99%
“…A 8% tensile strain reduced the thermal conductivity of pristine MoS 2 by 35% . However, it was also reported that tensile strain resulted in an increase in the thermal conductivity of amorphous silicon thin films, polymer chains, and silicene. , Therefore, the effect of mechanical strain on the thermal conductivity of MoS 2 needs to be studied in detail, in particular, in the presence of defects, as the work on the combined effect of stain and defects on the thermal conductivity of materials is still lacking.…”
Section: Resultsmentioning
confidence: 99%
“…The studies on strain-dependent thermal conductivity of solids and liquids can be traced back to 1970s and 1980s (Ross, et al, 1984), where strain was usually induced by pressure (compressive stress). The experimental demonstration of utilizing strain to actively control phonon and thermal properties has been applied to many different kinds of material systems (Hsieh, et al, 2009;Hsieh, et al, 2011;Alam, et al, 2015). Theoretical studies have also been performed to understand the origins of strain-dependent thermal conductivity of both bulk crystals (Picu, et al, 2003;Bhowmick and Shenoy, 2006;Li, et al, 2010;Parrish, et al, 2014) and nanostructured materials (Xu and Li, 2009;Xu and Buehler, 2009;Li, et al, 2010).…”
Section: Strain Effectsmentioning
confidence: 99%
“…In this light, efficient heat dissipation from the III-V materials grown on Si is desirable. In principle, both the presence of threading dislocations [11,12] and the residual thermal stress [13][14][15][16] can affect the thermal conductivity of the epitaxial III-V semiconductors grown on Si, directly impacting the thermal management in devices with multilayered structures. Despite a sparse number of previous studies regarding thermal transport in GaAs based devices [17], there has not been direct experimental evaluation of the effect of the TDD and the residual thermal stress on the thermal conductivity of realistic III-V materials grown on Si for photonic integrated circuit applications.…”
Section: Introductionmentioning
confidence: 99%