Mechanical reliability of silicon microstructures

Abstract

In this article, an overview of the mechanical reliability of silicon microstructures for micro-electro-mechanical systems (MEMS) is given to clarify what we now know and what we still have to know about silicon as a high-performance mechanical material on the microscale. Focusing on the strength and fatigue properties of silicon, attempts to understand the reliability of silicon and to predict the device reliability of silicon-based microstructures are introduced. The effective parameters on the strength and the mechanism of fatigue failure are discussed with examples of measurement data to show the design guidelines for highly reliable silicon microstructures and devices.

Deformations of Single-Crystal Silicon Circular Plate: Theory and Experiment

“…Since at this stage the problem is solved in a linear formulation, it is possible to use the superposition of solutions to determine the response on the full field of body forces. Thus the desired solution of the problem ( 6) can be presented in the same form (25) with the following parameters…”

“…It is also important to take into account the influence of tensile residual stresses that arise after performing the technological operations of the fabrication of thin-film Si membrane at different pressure and temperatures on the nature of its deflection under the impact of excess pressure. Relatively recently, a number of theoretical and experimental studies have been carried out in this direction, indicating the significant role of the initial deformation caused by a given distribution of thermal and internal mechanical stresses in the mechanical behavior of such thin-film membranes [22][23][24][25][26].…”

Optimization of the Geometry of a Microelectromechanical System Testing Device for SiO2—Polysilicon Interface Characterization

“…In the realm of microelectromechanical systems (MEMSs), the fusion of miniaturized mechanical and electrical components through microfabrication techniques has spearheaded a technological revolution. These devices have demonstrated immense potential for multiple applications, driven by their compact form and multifaceted functionalities [1][2][3][4]. However, amid the proliferation of their application, the crucial concern of reliability looms large [2,[5][6][7], particularly when they are exposed to challenging operational conditions such as high load cycles, elevated temperatures, and high humidities [8].…”

“…These devices have demonstrated immense potential for multiple applications, driven by their compact form and multifaceted functionalities [1][2][3][4]. However, amid the proliferation of their application, the crucial concern of reliability looms large [2,[5][6][7], particularly when they are exposed to challenging operational conditions such as high load cycles, elevated temperatures, and high humidities [8]. A thorough assessment of their mechanical reliability stands as a crucial requirement to propel the ongoing development of MEMSs.…”

Sensitivity Enhancement of Tube-Integrated MEMS Flow Sensor Using Flexible Copper on Polyimide Substrate

“…Traditionally, MEMS sensors have been fabricated based on Si materials [ 1 ]. This can be attributed to the excellent mechanical properties of Si and its processability by the semiconductor microfabrication technology [ 2 ].…”