Mechanical properties of Sn–Ag lead-free solder alloys based on the dendritic array and Ag3Sn morphology

Microstructural investigations and mechanical properties of pure lead-free (Sn–3.0Ag–0.5Cu and Sn–4.0Ag–0.5Cu) solder alloy

“…Since 2006 the environmental protection agencies (RoHS and WEEE) have banned the lead-containing portable electronic products because lead and leadcontaining products are toxic substances and it would be very harmful to the well-being of humans and the environment. So, the researchers are trying to find the other alternatives without Pb, and lead-free solders are good alternatives because lead-free solders are non-toxic [3][4][5][6][7][8].…”

“…Experimental results are characterizing the microstructural and mechanical properties of SAC305 and SAC 405 alloys. These two SAC solder alloys have been selected due to two main reasons: (i) to determine the effect of silver content on the microstructure and mechanical behavior and (ii) these alloys have been subjected a contradiction in the research [8].…”

“…As SAC solders (3 to 4 wt. % of Ag) having lower melting points and good solderability with excellent reliability, these solders are the original lead-free solder compositions for flip-chip solder [4][5][6][7][8][9].…”

“…For the characterization of mechanical properties of actual solder joints, the conventional techniques, nanoindentation can be used. However, these techniques provide only the properties of the individual phases in the solder joints and do not provide a value for the Poisson's ratio [5][6][7][8][9][10].…”

“…Reducing the Ag content can improve the reliability of SAC solder joints in dynamic environments. Addition of alloying elements such as SiC, Bi, Ni, and Ce will enhance the properties of SAC solder alloys in lead-free solder alloys [3][4][5][6][7][8][9][10][11].…”