Mechanical properties of nanocrystalline nickel films deposited by pulse plating

Shen, Y.F.; Xue, W.Y.; Wang, Y.D.; Liu, Z.Y.; Zuo, Liang

doi:10.1016/j.surfcoat.2008.05.027

Cited by 54 publications

(20 citation statements)

References 33 publications

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“…An average grain size of the Ni films grown on SiO 2 /Si(1 0 0) and MgO(0 0 1) at 300 K is about 30 nm. For nanocrystalline Ni samples, the yield strength ranges from 8.4 Â 10 8 Pa to 1.5 Â 10 9 Pa and the strain at the yield point is estimated to be 1-2% [21][22][23][24]. In the present work, the internal stress in the Ni films deposited at 300 K is 4.9-5.7 Â 10 8 Pa and the strain is about 0.15%.…”

Section: Discussionmentioning

confidence: 60%

Characteristics of Ni films deposited on SiO2/Si(100) and MgO(001) by direct current magnetron sputtering system with the oblique target

Yang¹,

Qiu²,

Chen³

et al. 2009

Applied Surface Science

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Section: Discussionmentioning

confidence: 60%

Characteristics of Ni films deposited on SiO2/Si(100) and MgO(001) by direct current magnetron sputtering system with the oblique target

Yang¹,

Qiu²,

Chen³

et al. 2009

Applied Surface Science

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“…The instrumented nanohardness values of Ni coatings obtained by dc method was 2492 MPa (230 VHN) compared to 3384 MPa (313 VHN) for pulsed Ni coatings. Refinement in grain size is thought to be responsible for an increase in the hardness of pulse coatings 15 . Carbon steel samples were dipped in NaH2PO4.H2O inhibitor for 24 hours and the top surface was examined using SEM.…”

Section: Characterization Of Electrodeposited Nimentioning

confidence: 99%

“…Conventionally, Ni coatings have been prepared using dc electrochemical methods [4][5][6][7] . More recently, use of pulse electrodeposition has become popular since it results in Ni coatings with refined grain structure 8,9 and attractive corrosion [10][11][12] and tribological properties [13][14][15][16][17][18] . Pulse plating is undertaken when current is applied in repetitive (pulse on -pulse off) square wave fashion rather than continuously as in dc plating.…”

Section: Introductionmentioning

confidence: 99%

Corrosion Behavior of Coarse- and Fine-Grain Ni Coatings Incorporating NaH2PO4.H2O Inhibitor Treated Substrates

et al. 2015

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Plain carbon steel substrates were treated with NaH2PO4.H2O inhibitor for 24 hours and coated with Ni using dc and pulse electrodeposition in standard Watt's bath. The effect of dc and pulse electrodeposition, on the microstructure and corrosion properties of Ni coatings in 3.5 wt% NaCl solution was studied. The effect of inhibitor on the deposition process and corrosion behavior was also examined. Materials characterization was performed using field emission scanning electron microscopy, cross-sectional scanning transmission electron microscopy, atomic force microscopy, x-ray diffraction and nanoindentation. Experimental results indicated that pulse electrodeposition produced fine grained Ni coatings that showed lower corrosion rate compared to coarse grained dc electrodeposited Ni. Pretreatment of substrates with inhibitor did not adversely affect the deposition process and adherent Ni coatings were readily developed. The results showed that pulse electrodeposition could be used to produce hard corrosion resistant Ni coatings while the inhibitor treatment yielded enhanced corrosion protection by providing a protective buffer layer between the Ni coating and the substrate.

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“…Let us calculate the characteristic energy difference W in example cases of scientifically and practically important [37][38][39][40][41][42][43][44] nanocrystalline films of AlN, GaN, 3C-SiC and Ni. We consider the following film/substrate systems: AlN/6H-SiC, GaN/6H-SiC, 3C-SiC/Si and Ni/Cu.…”

Section: Results Of Model Calculations In Example Cases Of Nanocrystamentioning

confidence: 99%

Stress relaxation through interfacial sliding in nanocrystalline films

Скиба¹,

Ovid’ko²,

Sheĭnerman³

2008

J. Phys.: Condens. Matter

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A special mechanism of stress relaxation in nanocrystalline films is suggested and theoretically described. The mechanism represents the interfacial sliding accompanied by the formation of wedge disclination dipoles at grain boundaries in nanocrystalline films. The wedge disclination dipoles release, in part, mismatch stresses generated at film-substrate boundaries. It is theoretically shown that the special relaxation mechanism is energetically favorable in various nanocrystalline films deposited onto single crystalline substrates (in particular, AlN/6H-SiC, GaN/6H-SiC, 3C-SiC/Si and Ni/Cu film/substrate systems) in wide ranges of their parameters.

show abstract

Mechanical properties of nanocrystalline nickel films deposited by pulse plating

Cited by 54 publications

References 33 publications

Characteristics of Ni films deposited on SiO2/Si(100) and MgO(001) by direct current magnetron sputtering system with the oblique target

Characteristics of Ni films deposited on SiO2/Si(100) and MgO(001) by direct current magnetron sputtering system with the oblique target

Corrosion Behavior of Coarse- and Fine-Grain Ni Coatings Incorporating NaH2PO4.H2O Inhibitor Treated Substrates

Stress relaxation through interfacial sliding in nanocrystalline films

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