2007
DOI: 10.1016/j.jallcom.2006.12.124
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Mechanical properties of nano-structured Ti-Si-N films synthesized by cathodic arc evaporation

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Cited by 30 publications
(19 citation statements)
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References 39 publications
(47 reference statements)
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“…It is well known that the mechanical performance of ceramic coatings is strongly influenced by internal residual stress 4–6 . For example, compressive stresses >10 GPa have been measured in TiSiN coatings using X‐ray diffraction (XRD) 4,7 .…”
Section: Introductionmentioning
confidence: 99%
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“…It is well known that the mechanical performance of ceramic coatings is strongly influenced by internal residual stress 4–6 . For example, compressive stresses >10 GPa have been measured in TiSiN coatings using X‐ray diffraction (XRD) 4,7 .…”
Section: Introductionmentioning
confidence: 99%
“…The residual stress in TiSiN coatings deposited by physical vapor deposition (PVD) on steel substrates consists of both intrinsic and extrinsic elements 8–10 . Intrinsic stresses result primarily from growth defects caused by ion bombardment during deposition 4,5 . In contrast, extrinsic stress (often termed thermal stress) is principally due to a mismatch in the coefficient of thermal expansion between the coating and its substrate 11,12 .…”
Section: Introductionmentioning
confidence: 99%
“…For example, an increase in hardness and strength causes the reduction of the coating's ductility and adherence to the substrate. The application of the nanostructure coatings is seen as the solution of this issue Yang et al, 2007). According to the Hall-Petch equation, the strength properties of the material rise along with the reduction of the grain size.…”
Section: Introductionmentioning
confidence: 99%
“…This includes bias voltage, which significantly influences the atom mobility on the coating surface and ion bombardment [10][11][12][13]. As an effective method, cathodic arc assisted magnetron sputtering has been used for deposition of various hard protective coatings because it overcame the shortcomings of pure magnetron sputtering, such as low ionization of the reactants during deposition and poor adhesion of the resulted films [14][15][16][17][18]. Recently, middle-frequency (MF) magnetron sputtering technology has been developed, which offers a high deposition rate and stable process compared with direct current and radio frequency magnetron sputtering [19,20].…”
Section: Introductionmentioning
confidence: 99%