1979
DOI: 10.1016/0040-6090(79)90452-8
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Mechanical properties of hard carbon films

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Cited by 68 publications
(8 citation statements)
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“…Furthermore, the amorphous substrate cannot be expected to .play any role in constraining the propagation direction. The parallel sinusoidal buckling on a glass substrate observed by both Weissmantel and co-workers [7,8] and Nir [9] cannot be observed in the present work. As for the parallel buckling waves, the presence .of anisotropic internal stress might be the reason, as Nir points out [9].…”
Section: Resultscontrasting
confidence: 53%
See 1 more Smart Citation
“…Furthermore, the amorphous substrate cannot be expected to .play any role in constraining the propagation direction. The parallel sinusoidal buckling on a glass substrate observed by both Weissmantel and co-workers [7,8] and Nir [9] cannot be observed in the present work. As for the parallel buckling waves, the presence .of anisotropic internal stress might be the reason, as Nir points out [9].…”
Section: Resultscontrasting
confidence: 53%
“…In 1979 Weissmantel and co-workers [7,8] first reported sinusoidal stress relief patterns of DLC films on glass and NaC1 substrates. Their study was, however, limited to the observation itself.…”
Section: Introductionmentioning
confidence: 99%
“…3, all the films have internal compressive stresses that reach a maximum at VH2 = 10%. These 'kinds of compressive stress have been observed in the carbon films prepared by other preparation methods such as evaporation and arcing (25)- (27). The in-H, content in sputtering gas, V, , (%) ternal stresses observed might be intrinsic stresses caused by impurities and incomplete structural ordering in the films ( I ) .…”
Section: Results and Dlscussionmentioning
confidence: 96%
“…Excessive residual stresses in thin films can result in severe problems for the above mentioned applications. For instance, compressive residual stresses may induce adhesion failure between film and substrate giving rise to buckling phenomenon above a critical film thickness [3]. That is the case for films prepared using sputtering techniques for which the film thickness is a limiting factor for future applications.…”
Section: Introductionmentioning
confidence: 99%