Mechanical properties of copper‐clad laminate using composite naphthalene–phenyl‐based epoxy as prepreg

Duann, Yeh-Fang; Chen, Bor-Lin; Tsai, Teh-Hua

doi:10.1002/app.21399

Cited by 19 publications

(11 citation statements)

References 23 publications

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“…In face prepreg production, primary phenolic resin8, 9 cannot generally be used under conditions of DMF solvent system. Hence, evaluation was limited to the effect of filler on impact energy.…”

Section: Discussionmentioning

confidence: 99%

Effects of various fillers on CEM‐1 laminate punchability

Chiu¹,

Cheng²

2006

J of Applied Polymer Sci

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ABSTRACT:The primary objective of this study is to emphasize the modification of the epoxy resin formulation by implementing falling weight test to discuss reduction of impact energy and apply the thesis to improve the punchability on the CEM-1 copper clad laminate. Experimental results demonstrate that the core structure can be modified with different phenolic resin; when phenolic resin PF-440 of a smaller molecular weight is used as the modified agent, the impact energy can be lowered by 17%. In addition, three kinds of inorganic fillers, such as TiO 2, Al(OH) 3, SiO 2, are added and the core and face structure were modified separately. Adding these fillers has a small effect on lowering the impact energy and no clear evidence of tendency, while the phenolic resin has significant effect. When 10 phr TiO 2 is added to face, the impact energy can be lowered around 60% and has a visible effect on improving the punchability improvement of CEM-1 copper clad laminate.

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Section: Discussionmentioning

confidence: 99%

Effects of various fillers on CEM‐1 laminate punchability

Chiu¹,

Cheng²

2006

J of Applied Polymer Sci

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“…With the advancement of technology and the increasing awareness of human environmental protection, the development of new technologies such as lead-free soldering has become more and more demanding for CCLs, including not only the thermal properties and mechanical properties of CCLs, but also green environmental protection. [1][2][3][4][5][6][7][8] At present, the resin used in rigid CCLs is basically epoxy resin. Due to the problem of high brittleness of the cured epoxy resin, the CCL prepared by the epoxy resin has a large brittleness, which is prone to cracking during the cutting and stamping process.…”

Section: Introductionmentioning

confidence: 99%

Application of bio‐based dimer acid diglycidyl ester in paper‐based copper clad laminate

Sun

Zong

Wang

et al. 2019

J of Applied Polymer Sci

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Using dimer acid (DA) as raw material, DA diglycidyl ester (DADGE) was synthesized and used as reactive toughening agent to prepare paper‐based copper clad laminate (p‐CCL). The factors affecting the epoxy value of DADGE and the effect of the resin on the gelation time were studied. The effects of the epoxy value and the addition amount of DADGE on the solderleaching resistance, flammability, water absorption, bending strength, and impact strength of the p‐CCL were discussed. The results showed when the molar ratio of DA to ECH was 1:8 and the molar ratio of DA to sodium hydroxide was 1:1.6, the epoxy value of DADGE reached the maximum value of 0.23 mol/100 g. The DADGE can shorten the gelation time of the glue. The p‐CCL meets the performance of the IPC‐TM‐650 standard. And when the addition amount of DADGE is less than 12 wt %, the flammability of the p‐CCL reaches UL94V‐0 level. The p‐CCL prepared by adding 6 wt % of DADGE with 0.08 mol/100 g epoxy value has the best comprehensive performance, its toughness and rigid are comparable to those of p‐CCL with 12 wt % of commercially available high performance toughening agents and it has higher solderleaching resistance. © 2019 Wiley Periodicals, Inc. J. Appl. Polym. Sci. 2019, 136, 47508.

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“…Improved Copper Clad Laminates (CCLs) that exhibit good heat resistance, low dielectric constant, low dielectric loss and good dimensional stability are required by the electronics industry . EP is widely used to prepare common CCLs, however, these CCLs are not suited for high frequency applications (>1 GHz) . Polyphenylene oxide (PPO) is a high‐performance resin, whose glass transition temperature is >200°C and whose dielectric constant can be as low as 2.45 at 1 MHz working frequency, with a loss factor of 7 × 10 −4 .…”

Section: Introductionmentioning

confidence: 99%

Synthesis and properties of cured epoxy mixed resin systems modified by polyphenylene oxide for production of high‐frequency copper clad laminates

Weng

Zhang

et al. 2017

Polymer Composites

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Redistributed polyphenylene oxide (rPPO) was synthesized and used to modify epoxy resin for use as high‐frequency Copper Clad Laminates (CCLs). The chemical composition, thermal stability and micro morphology of cured rPPO/(Epoxy resin)EP mixed resin systems were analyzed and their mechanical, thermal conductivity and dielectric properties determined. These results revealed that the molecular weight of rPPO containing 20 wt% bisphenol A (BPA) was greatly reduced, with a number‐average molecular weight of rPPO as low as 2652.7. Cured rPPO/EP mixed resin systems were prepared with improved heat resistance properties, exhibiting a maximum heat weight loss temperature (Td50%) of 421°C, that was 151°C higher than that observed for pure epoxy resin. Scanning results show that reducing the molecular weight of PPO effectively improves the compatibility with E‐51. Broadband dielectric spectrum analysis revealed that the cured rPPO/EP mixed resin systems had a lower dielectric constant (3.76/107 Hz) and a smaller dielectric loss of 2.11 × 10−3/107 Hz than pure epoxy resin. Similarly, composite laminates derived from cured rPPO/EP mixed resin also showed a lower dielectric constant (4.65/107 Hz) and dielectric loss (6.25 × 10−4/107 Hz) than laminates derived from pure epoxy resin. POLYM. COMPOS., 39:E2334–E2345, 2018. © 2017 Society of Plastics Engineers

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Mechanical properties of copper‐clad laminate using composite naphthalene–phenyl‐based epoxy as prepreg

Cited by 19 publications

References 23 publications

Effects of various fillers on CEM‐1 laminate punchability

Effects of various fillers on CEM‐1 laminate punchability

Application of bio‐based dimer acid diglycidyl ester in paper‐based copper clad laminate

Synthesis and properties of cured epoxy mixed resin systems modified by polyphenylene oxide for production of high‐frequency copper clad laminates

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