Mechanical properties and corrosion analysis of lead-free Sn–0.7Cu solder CSI joints on Cu substrate

Sonawane, Pushkaraj D.; Raja, V.K. Bupesh; Gupta, Manoj

doi:10.1016/j.matpr.2021.01.521

Cited by 7 publications

(2 citation statements)

References 15 publications

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“…Since the ban on using lead for soldering alloys, owing to its toxicity [1][2][3][4][5], immense research and development of new lead-free soldering alloys is in progress. This R&D is primarily oriented to the study of properties such as excellent wettability, thermal and electrical conductivity, corrosion resistance, and, last but not least, a favorable price.…”

Section: Introductionmentioning

confidence: 99%

Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate

Kolenak,

Pluhar,

Drapala

et al. 2024

Applied Sciences

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The aim of this study was to characterize a Zn-Mg type soldering alloy and direct soldering of SiC ceramics with a copper substrate. The Zn1.5Mg solder exerts a wider melting interval. The temperature of the eutectic reaction was 365 °C, and the liquidus temperature was 405 °C. The microstructure of the soldering alloy is comprised of a zinc matrix. Segregation of binary eutectics in the form of (Zn) + Mg2Zn11 lamellas occurred on the boundaries of Zn grains. Additionally, the presence of a MgZn2 magnesium phase was observed in the solder matrix. The SiC/solder bond was formed due to magnesium distribution from solder to the boundary with SiC ceramics, where magnesium reacts with silicon, which is infiltered in SiC ceramics. By a mutual interaction, a new Mg2Si phase is formed. An interaction between the molten zinc solder and Cu substrate occurred on the boundary of the Cu/substrate joint at the formation of a transition zone composed of two new phases, namely the γCu (Cu5Zn8) non-wettable phase type, approximately 30 µm wide, and a wettable (CuZn4) phase type ε, approximately 12 µm wide. The average shear strength of a combined SiC/Cu joint fabricated using Zn1.5Mg solder was 44 MPa.

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Section: Introductionmentioning

confidence: 99%

Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate

Kolenak,

Pluhar,

Drapala

et al. 2024

Applied Sciences

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“…The reliability of high-performance connection materials is very important for the long-lasting use of electronic devices. Compared to other ternary Pb-free soldering alloys, SAC305 alloy has started widespread use as an electrical conduction material in the microelectronics industry and in the connection of devices, due to its lower melting temperature, high wetting ability, and higher mechanical durability [7,8].…”

Section: Introductionmentioning

confidence: 99%

Hidroklorik Asit çözeltisinde bizmut ilavesinin Sn – 3Ag – 0.5Cu lehim alaşımının korozyon dinamiklerine etkisi

Erer

2021

International Journal of Innovative Engineering Applications

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Original scientific paperThis study aims to investigate the effects of bismuth addition on the corrosion behaviour of Sn-3.0Ag-0.5Cu (SAC 305) solder alloy in 1M HCl acid solution under potentiodynamic polarization. After electrochemical tests, scanning electron microscopy (SEM) and energy dispersive X-ray spectroscopy (EDX) were used to examine and characterize the properties of the samples. Polarization studies indicate that the addition of 0.5, 1, and 2 wt.% Bi in the SAC305 solder alloy does not significantly change the corrosion potentials. Instead of a true passivation region, a pseudo-passivation region is observed in which currents are nearly constant (though high). This pseudo-passive region does not include a reactivation point within the scanning interval. On the other hand, the corrosion rates follow a pattern in which 1 wt.% bismuth replacement of silver causes a decrement in corrosion rate. However, the corrosion rate increases with the further replacement of silver with bismuth. Microstructure analysis reveals the existence of gaps and porosities which introduce limits on the formation and stability of protective passive corrosion products.

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A Simulation Study on Interfacial Reaction Between Sn3Ag0.5Cu and Sn0.7Cu Using Different Substrates After Reflow Soldering

Zaki

Idris

2022

Technological Advancement in Mechanical and Automotive Engineering

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Mechanical properties and corrosion analysis of lead-free Sn–0.7Cu solder CSI joints on Cu substrate

Cited by 7 publications

References 15 publications

Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate

Characterization of an Active Soldering Zn-Mg Alloy and the Study of Ultrasonic Soldering of SiC Ceramics with Copper Substrate

Hidroklorik Asit çözeltisinde bizmut ilavesinin Sn – 3Ag – 0.5Cu lehim alaşımının korozyon dinamiklerine etkisi

A Simulation Study on Interfacial Reaction Between Sn3Ag0.5Cu and Sn0.7Cu Using Different Substrates After Reflow Soldering

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