Mechanical fatigue test method for chip/underfill delamination in flip-chip packages

Hirohata, Kenji; Kawamura, Noriyasu; Mukai, Minoru; Kawakami, Takashi; Aoki, Hideo; Takahashi, Kuniaki

doi:10.1109/tepm.2002.804617

Cited by 25 publications

(7 citation statements)

References 5 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…From observation, the results showed that the formation of cracks on the surface of the silicon die may be caused by exposure to gamma radiation. In the three-point bending test, the concentrated load could be given directly at the midpoint of the package [18]. When the load is applied, the package will deflect significantly (proportional to the load).…”

Section: Resultsmentioning

confidence: 99%

Gamma-irradiation effect on material properties behaviour of semiconductor package

Yusoff

Jalar²,

Othman³

et al. 2013

AIP Conference Proceedings

View full text Add to dashboard Cite

Current trends in digitization led to the application of an electronic package in many fields which are exposed to radioactive environment. Quad-Flat No-Lead (QFN) package technology is among the latest form of semiconductor package development in submicron size scale. A QFN package is designed by combining multimaterial and multitechnology. The ability to predict and eventually to prevent mechanical failures of microelectronics has becoming increasingly important in the development of semiconductor technology. Therefore, the relationship between the microstructure property behaviour of QFN semiconductor package and gamma irradiation has been investigated. The inhouse fabricated QFN was exposed to gamma radiation from a Cobalt-60 source with different doses varies from 0.5 Gy, and 50.0 kGy. Following, the packages were then subjected to Scanning Acoustic Microscope (CSAM) and X-ray Imaging System (3D X-ray) in order to identify internal discontinuity due to irradiation. In this investigation, the three point bending technique was used to obtain the flexural strength of the package. Irradiation packages have shown a decrease in their flexural strength with the increasing of gamma dose. In-depth analysis exhibited that the increment of exposure dose also influenced the occurrence of delamination between silicon die and copper leadframe. The cracks were also observed on the surface of the silicon die. The gamma irradiation is believed to play an important role towards the microstructure property behaviour of SDQFN package.

show abstract

Section: Resultsmentioning

confidence: 99%

Gamma-irradiation effect on material properties behaviour of semiconductor package

Yusoff

Jalar²,

Othman³

et al. 2013

AIP Conference Proceedings

View full text Add to dashboard Cite

show abstract

“…4 are not captured by previous studies [4][5][6][7][8][9][10][11][12]. The complex trends vs. underfill modulus underlines the facts that the ERR dependence on underfill modulus is not straightforward: it also depends on other factors including underfill CTE, crack size, die size, die aspect ratio, fillet profile, etc, and the interactions among these factors.…”

Section: Effect Of Underfill Modulusmentioning

confidence: 90%

3D fracture mechanics analysis of underfill delamination for flip chip packages

Zhang

Zhai

Master

2008

2008 11th Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems

View full text Add to dashboard Cite

In flip-chip package, the mismatch of thermal expansion coefficients between the silicon die, copper heat spreader and packaging substrate induces concentrated stress field around the edges and corners of silicon die during assembly, testing and services. The concentrated stresses result in delamination on various interfaces involving a range of length scales from hundreds of nanometers to millimeters. Among these failures underfill delamination is a dominant failure mode. In this paper, a full parametric 3D model of flip chip package with heat spreader is developed with the capability of explicit modeling of 3D cracks. The crack driving force is computed as the functions of underfill properties including coefficient of thermal expansion and Young's modulus, as well as underfill fillet dimensions. The impact of different shapes of crack front is also investigated. The results show that underfill properties need to be optimized to minimize the occurrence of underfill delamination at the die corner. The results also show that there exists an optimal range of underfill fillet height to balance the manufacturability and reliability.

show abstract

“…The stress relief in solder joints due to the underfill, possible failure mechanisms, and the role and attributes of the visco-elastic behavior of the underfill material were assessed by Suryanarayana et al [106], Gilleo and Blumel [107], Semmens and Adams [108], Guo et al [109], Fan et al [110], Hirohata et al [111], Chai et al [112], and Erickson et al [113]. No modeling is possible, of course, if the mechanical/physical characteristics of the material are not available.…”

mentioning

confidence: 99%

Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace Electronics—Brief Review

Suhir

Ghaffarian

2018

Aerospace

View full text Add to dashboard Cite

In this review, some major aspects of the current underfill technologies for flip-chip (FC) and fine-pitch-ball-grid-array (FPBGA), including chip-size packaging (CSP), are addressed, with an emphasis on applications, such as aerospace electronics, for which high reliability level is imperative. The following aspects of the FC and FPGGA technologies are considered: attributes of the FC and FPBGA structures and technologies; underfill-induced stresses; the roles of the glass transition temperature (T g) of the underfill materials; some major attributes of the lead-free solder systems with underfill; reliability-related issues; thermal fatigue of the underfilled solder joints; warpage-related issues; attributes of accelerated life testing of solder joint interconnections with underfills; and predictive modeling, both finite-element-analysis (FEA)-based and analytical ("mathematical"). It is concluded particularly that the application of the quantitative assessments of the effect of the fabrication techniques on the reliability of solder materials, when high reliability is imperative, is critical and that all the three types of research tools that an aerospace reliability engineer has at his/her disposal, should be pursued, when appropriate and possible: experimental/testing, finite-element-analysis(FEA) simulations, and the "old-fashioned" analytical ("mathematical") modeling. These two modeling techniques are based on different assumptions, and if the computed data obtained using these techniques result in the close output information, then there is a good reason to believe that this information is both accurate and trustworthy. This effort is particularly important for high-reliability FC and FPBGA applications, such as aerospace electronics, as the aerospace IC packages become more complex, and the requirements for their failure-free operations become more stringent.

show abstract

Mechanical fatigue test method for chip/underfill delamination in flip-chip packages

Cited by 25 publications

References 5 publications

Gamma-irradiation effect on material properties behaviour of semiconductor package

Gamma-irradiation effect on material properties behaviour of semiconductor package

3D fracture mechanics analysis of underfill delamination for flip chip packages

Flip-Chip (FC) and Fine-Pitch-Ball-Grid-Array (FPBGA) Underfills for Application in Aerospace Electronics—Brief Review

Contact Info

Product

Resources

About