Gamma-irradiation effect on material properties behaviour of semiconductor package

Abstract

Current trends in digitization led to the application of an electronic package in many fields which are exposed to radioactive environment. Quad-Flat No-Lead (QFN) package technology is among the latest form of semiconductor package development in submicron size scale. A QFN package is designed by combining multimaterial and multitechnology. The ability to predict and eventually to prevent mechanical failures of microelectronics has becoming increasingly important in the development of semiconductor technology. Therefore, the relationship between the microstructure property behaviour of QFN semiconductor package and gamma irradiation has been investigated. The inhouse fabricated QFN was exposed to gamma radiation from a Cobalt-60 source with different doses varies from 0.5 Gy, and 50.0 kGy. Following, the packages were then subjected to Scanning Acoustic Microscope (CSAM) and X-ray Imaging System (3D X-ray) in order to identify internal discontinuity due to irradiation. In this investigation, the three point bending technique was used to obtain the flexural strength of the package. Irradiation packages have shown a decrease in their flexural strength with the increasing of gamma dose. In-depth analysis exhibited that the increment of exposure dose also influenced the occurrence of delamination between silicon die and copper leadframe. The cracks were also observed on the surface of the silicon die. The gamma irradiation is believed to play an important role towards the microstructure property behaviour of SDQFN package.

Understanding Package Crack Signatures in a Leadframe Semiconductor Package

“…Durability test on QFN packages under constant cyclic bending loadings was also analyzed using the approaches of signal processing technique involving comparison of strain response [10]. Three point bending technique of a QFN package was used for obtaining the flexural strength to understand the impact of gamma irradiation [11]. A related investigation on package cracking and delamination induced by clamping process was conducted using finite element software simulation and found that optimized clamping tool geometry and movement can reduce clamping induced stress and therefore can eliminate package cracking and delamination even if clamping a bent lead frame [12].…”

Amino Anthraquinone: Synthesis, Characterization, and Its Application as an Active Material in Environmental Sensors

“…Many of the organic semiconductors known are very stable and sensitive towards temperature, radiation and humidity [11][12][13]. Low molecular weight organic semiconductors-based capacitive and resistive surface type sensors are of great interest due to their low cost and simple fabrication methods.…”

“…Surface type sensors are easy to fabricate, are lower cost alternatives and offer simple technology for exploring different properties of organic semiconductors, such as the effect of humidity [29], the effect of temperature [31] and light sensitivity [11]. Various surface type resistive and capacitive sensors using the organic semiconductors, methyl orange (MO) [32], perylenes [13], porphyrins [33] and phthalocyanines [10,34] were previously reported. However, in the aforementioned semiconductor-based sensors, the detection of change in capacitance in response to the humidity of was observed from around 50% or 60%RH which meant that below 50%RH the sensors were inactive, whereas a good sensor suitable for practical applications should have the quality to sense the in broad range.…”