Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability

Tsai, Ming-Yi; Huang, P. S.; Lin, Chwan-Fwu; Wu, Ching-Wen; Hu, Sung-Cheng

doi:10.1016/j.microrel.2015.08.010

Cited by 24 publications

(4 citation statements)

References 5 publications

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“…electrode response rate and polarization do not decrease (Figs. 3,4,5,and 6). Laser remelting causes mutual diffusion between titanium and copper, thus resulting in a composite remelting layer containing titaniumcopper intermetallic compounds such as CuTi, CuTi 2 , and Cu 4 Ti.…”

Section: Resultsmentioning

confidence: 99%

激光重熔/电化学沉积交互处理铜涂层的微观组织及机理研究

Tingchao¹,

Yanyi²,

Danhua³

et al. 2023

Chin. J. Laser

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Objective To improve the poor deposition quality and binding force of copper electrodeposited directly on titanium , a new laser remelting/electrochemical deposition interaction process is proposed to prepare a titaniumcopper alloy layer and thicken the copper layer. The micromorphology, crosssectional elements, coating thickness, and phase of the composite remelting layer obtained from laser remelting/electrochemical deposition interaction process are investigated. The effect mechanism of the laser electrochemical interaction on the electrical conductivity, hightemperature oxidation resistance, and adhesion to the substrate of the composite coating is discussed.

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Section: Resultsmentioning

confidence: 99%

激光重熔/电化学沉积交互处理铜涂层的微观组织及机理研究

Tingchao¹,

Yanyi²,

Danhua³

et al. 2023

Chin. J. Laser

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“…The Sklar theorem [25] guarantees the existence and uniqueness of the Copula C  in any two-dimensional random variable ( , ) XY .…”

Section: The Component Reliability Calculation Model Based On the Strmentioning

confidence: 99%

“…Theorem 1 [25] Let the marginal distribution function of the two-dimensional random variable be ( ), ( ) FG  . Then, there exists only the two-dimensional Copula ( , )…”

Section: The Component Reliability Calculation Model Based On the Strmentioning

confidence: 99%

Dynamic Time Series Reliability Analysis for Long-Life Mechanic Parts with Stress-Strength Correlated Interference Model

Suo¹

2019

IJPE

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Based on data of the equivalent stress from the ANSYS for a loaded hollow shaft, the correlation between a mechanical part's elastic modulus and the corresponding Von Mises stress is statistically verified in this paper. Using the Copula correlation theory, a static reliability model involving stress-strength interference is built. According to the performance degradation data of mechanical parts with long-life and high-reliability, deterministic time series models are used to extract the characteristic information of the distribution of degradation variables, and then a method is proposed for estimating the characteristic parameters of degradation strength and integrated stress. Two-stage maximum likelihood estimation is applied to determine the scalar degree of correlation between both, and then a reliability assessment of long-life mechanical parts is completed.

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“…DBA/AMB basically has a ceramic insulator plate composed of materials such as Al 2 O 3 , AlN, and Si 3 N 4 . Both sides of an insulator plate are metalized by aluminum (Al) or copper (Cu) to function as a thermal and electrical conductor layer [8]. Such a metal layer enables not only improved thermal conductivity but also creates electrical circuits on an insulator plate.…”

Section: Introductionmentioning

confidence: 99%

Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules

et al. 2018

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The thermal cycling life of direct bonded aluminum (DBA) and active metal brazing (AMB) substrates with two types of plating—Ni electroplating and Ni–P electroless plating—was evaluated by thermal shock tests between −50 and 250 °C. AMB substrates with Al2O3 and AlN fractured only after 10 cycles, but with Si3N4 ceramic, they retained good thermal stability even beyond 1000 cycles, regardless of the metallization type. The Ni layer on the surviving AMB substrates with Si3N4 was not damaged, while a crack occurred in the Ni–P layer. For DBA substrates, fracture did not occur up to 1000 cycles for all kind of ceramics. On the other hand, the Ni–P layer was roughened and cracked according to the severe deformation of the aluminum layer, while the Ni layer was not damaged after thermal shock tests. In addition, the deformation mechanism of an Al plate on a ceramic substrate was investigated both by microstructural observation and finite element method (FEM) simulation, which confirmed that grain boundary sliding was a key factor in the severe deformation of the Al layer that resulted in the cracking of the Ni–P layer. The fracture suppression in the Ni layer on DBA/AMB substrates can be attributed to its ductility and higher strength compared with those of Ni–P plating.

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Mechanical design and analysis of direct-plated-copper aluminum nitride substrates for enhancing thermal reliability

Cited by 24 publications

References 5 publications

激光重熔/电化学沉积交互处理铜涂层的微观组织及机理研究

激光重熔/电化学沉积交互处理铜涂层的微观组织及机理研究

Dynamic Time Series Reliability Analysis for Long-Life Mechanic Parts with Stress-Strength Correlated Interference Model

Thermal Shock Performance of DBA/AMB Substrates Plated by Ni and Ni–P Layers for High-Temperature Applications of Power Device Modules

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