Mechanical degradation of microelectronics solder joints under current stressing

Pb phase coarsening in eutectic Pb/Sn flip chip solder joints under electric current stressing

“…This tendency is true in both the future high density flip chip packaging and power packaging Liu et al, 1999Liu et al, , 2000Ye et al, 2002a). Electromigration in solder joints has been reported and studied by several researchers recently (Brandenburg and Yeh, 1998;Liu et al, 1999Liu et al, , 2000Tu and Zeng, 2001;Ye et al, 2002bYe et al, , 2003a. The reliability of solder joint under thermomechanical fatigue loading has been extensively studied in recent years (Basaran and Tang, 2001;Basaran and Chandaroy, 1998;Chow and Wei, 1999;Dasgupta and Hu, 1992;Solomon, 1986;Solomon and Tolksdorf, 1996).…”

Electro- and thermo-migration induced failure mechanisms in Package on Package

“…A FR-4 board is mounted between the packages. Because of the glass fiber reinforcement the material properties in vertical direction (Y) differ from the values in horizontal direction (X, Z) [21]. EDX analysis showed that the traces are made of 99% Cu and the UBM of 99% Ni, so the material parameters of pure Cu and pure Ni were used.…”

A thermodynamic model for electrical current induced damage

“…The nature of electromigration in solder alloys (especially lead free solder alloys) is currently investigated and is expected to be different from that in metal interconnect lines, i.e. Cu and Al (Ye et al, 2003d). This is primarily due to the differences in the materials properties and the microstructures of a typical solder alloy and pure metal VLSI interconnect lines.…”