“…This tendency is true in both the future high density flip chip packaging and power packaging Liu et al, 1999Liu et al, , 2000Ye et al, 2002a). Electromigration in solder joints has been reported and studied by several researchers recently (Brandenburg and Yeh, 1998;Liu et al, 1999Liu et al, , 2000Tu and Zeng, 2001;Ye et al, 2002bYe et al, , 2003a. The reliability of solder joint under thermomechanical fatigue loading has been extensively studied in recent years (Basaran and Tang, 2001;Basaran and Chandaroy, 1998;Chow and Wei, 1999;Dasgupta and Hu, 1992;Solomon, 1986;Solomon and Tolksdorf, 1996).…”