Mechanical Characterization of Low-Dimensional Structures Through On-Chip Tests

Abstract

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Monitoring fatigue damage growth in polysilicon microstructures under different loading conditions

“…A set of 31 specimens have been used to evaluate the average voltage for instantaneous rupture Vcr = 67 V and to evaluate the corresponding critical principal tensile stress in the notch as described for this and other devices in [15,16,21]: the resulting failure probability is >0.1 at = 3.550 GPa, it is equal to 0.5 at Prior to applying the fatigue cycles, each microsystem has been characterized and its main mechanical parameters have been evaluated in order to screen for abnormalities and to discard devices that did not respect the condition f res < 0.005 f res .…”

On-Chip Mechanical Characterization using an Electro-thermo-mechanical Actuator

“…The advantages of on-chip approaches for the mechanical characterization at the micro scale derive from the possibility to test the material in conditions almost identical to those found in the real applications, thus avoiding external disturbances coming from off-chip laboratory tests [14].…”

“…The present paper is focused on the mechanical characterization of materials at the micron scale by means of a fully on-chip methodology [8][9][10][11][12][13][14]. The advantages of on-chip approaches for the mechanical characterization at the micro scale derive from the possibility to test the material in conditions almost identical to those found in the real applications, thus avoiding external disturbances coming from off-chip laboratory tests [14].…”