Mechanical behavior of Cu-W interface systems upon tensile loading from molecular dynamics simulations

Ma, Guang; Fan, Jing; Gong, Hai

doi:10.1016/j.commatsci.2018.05.030

Cited by 43 publications

(9 citation statements)

References 33 publications

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“…During the past decades, the binary system of tungsten (W) and copper (Cu) has been attracted considerable research interests and has been commonly utilized as heat sinks in microelectronics, high voltage electrical contacts, nuclear fusion components, packing components, and welding elec trodes, etc [1][2][3][4][5][6][7][8][9][10][11][12][13][14][15][16]. These possible applications are mainly attributed to the excellent combination of quite different prop erties of W and Cu, i.e.…”

Section: Introductionmentioning

confidence: 99%

Strain-stress relationship and dislocation evolution of W–Cu bilayers from a constructed n-body W–Cu potential

Wei

Chen

Gong

et al. 2019

J. Phys.: Condens. Matter

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An n-body W–Cu potential is constructed under the framework of the embedded-atom method by means of a proposed function of the cross potential. This W–Cu potential is realistic to reproduce mechanical property and structural stability of WCu solid solutions within the entire composition range, and has better performances than the three W–Cu potentials already published in the literature. Based on this W–Cu potential, molecular dynamics simulation is conducted to reveal the mechanical property and dislocation evolution of the bilayer structure between pure W and W0.7Cu0.3 solid solution. It is found that the formation of the interface improves the strength of the W0.7Cu0.3 solid solutions along tensile loading perpendicular to the interface, as the interface impedes the evolution of the dislocation lines from the W0.7Cu0.3 solid solutions to the W part. Simulation also reveals that the interface has an important effect to significantly reduce the tensile strength and critical strain of W along the tensile loading parallel to the interface, which is intrinsically due to the slip of the edge or screw dislocations at low strains as a result of the lattice mismatch.

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Section: Introductionmentioning

confidence: 99%

Strain-stress relationship and dislocation evolution of W–Cu bilayers from a constructed n-body W–Cu potential

Wei

Chen

Gong

et al. 2019

J. Phys.: Condens. Matter

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show abstract

“…Gong et al [4] investigated the relationship between the nature and structure of the interface under tensile loading by molecular dynamics calculations. Iwasaki [4] used molecular dynamics and investigated the adhesion strength of the Cu/W interface. All of the above interface studies are valuable, but there is still a need for further research and exploration.…”

Section: Introductionmentioning

confidence: 99%

“…Liang et al [14] obtained the interfacial energy and electronic structure of the tungsten-copper gradient interface by First principles calculations. Gong et al [4] investigated the relationship between the nature and structure of the interface under tensile loading by molecular dynamics calculations. Iwasaki [4] used molecular dynamics and investigated the adhesion strength of the Cu/W interface.…”

Section: Introductionmentioning

confidence: 99%

Multi-scale simulations of the mechanical behaviors of the W-Cu joint interface with a diffusion layer

Chen

Xie

Huang

2023

Preprint

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At the interface of W-Cu after direct jointing, diffusion layers with a thickness of approximately 22 nm are present but often overlooked in simulations of mechanical properties. This study establish an interface model with a W-Cu diffusion layer using molecular dynamics (MD). The influence of the diffusion layer on the elastic-plastic behaviors, dissipation mechanisms and fracture properties of the interface is analyzed under mode-I (perpendicular to the interface) and mode-II (parallel to the interface). The results demonstrate that the interface model with a diffusion layer exhibits superior mechanical properties under mode-I and mode-II loading when compared to the model without a diffusion layer. Furthermore, a multi-scale method based on the classical Paris law is then proposed, which combines molecular dynamics (MD) and finite element methods to investigate the fatigue crack propagation of W-Cu bimetallic composites under cyclic loading and predict their fatigue life. The findings of this study are meaningful for improving the mechanical properties of W-Cu interface materials, predicting the material's lifespan, and guiding related engineering applications.

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“…Copper-tungsten metal matrix composites (Cu-W MMCs) are the most widely used electrical contact materials in HVCBs. Cu-W MMCs consist of a W matrix with Cu being melted into the W skeleton, taking advantage of the excellent electrical and thermal conductivity properties of Cu, as well as the good mechanical properties and outstanding arc resistance performance of W [7][8][9][10][11][12][13][14]. With continuous switching cycles, Cu on the surface will be lost due to arc erosion, resulting in damages to the structure of the arcing contacts.…”

Section: Introductionmentioning

confidence: 99%

A molecular dynamics simulation study on the role of graphene in enhancing the arc erosion resistance of Cu metal matrix

Xu¹,

Zhou

Wang

et al. 2022

Computational Materials Science

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Mechanical behavior of Cu-W interface systems upon tensile loading from molecular dynamics simulations

Cited by 43 publications

References 33 publications

Strain-stress relationship and dislocation evolution of W–Cu bilayers from a constructed n-body W–Cu potential

Strain-stress relationship and dislocation evolution of W–Cu bilayers from a constructed n-body W–Cu potential

Multi-scale simulations of the mechanical behaviors of the W-Cu joint interface with a diffusion layer

A molecular dynamics simulation study on the role of graphene in enhancing the arc erosion resistance of Cu metal matrix

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