Mechanical and chemical adhesion at the encapsulant interfaces in laminated photovoltaic modules

Nivelle, Philippe; Borgers, Tom; Voroshazi, Eszter; Poortmans, Jef; D’Haen, Jan; Ceuninck, W. De; Daenen, Michaël

doi:10.1109/irps.2018.8353630

Cited by 1 publication

(2 citation statements)

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“…Common low temperature solders consist of tin (Sn) with varying compositions of bismuth (Bi) or indium (In). Bi soldering alloys tend to have higher strength but reduced ductility and susceptibility to thermal aging [52][53][54][55][56][57][58]. On the other hand, In is a much softer alloy, which reduces its strength, yet it has greater ductility.…”

Section: Introductionmentioning

confidence: 99%

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Interconnections for Additively Manufactured Hybridized Printed Electronics in Harsh Environments

Neff

Elston

Schrand

2020

Designs

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The ability to fabricate functional 3D conductive elements via additive manufacturing has opened up a unique sector of ‘hybridized printed electronics’. In doing so, many of the rigid standards (i.e., planar circuit boards, potting, etc.,) of traditional electronics are abandoned. However, one critical challenge lies in producing robust and reliable interconnections between conductive inks and traditional hardware, especially when subjected to harsh environments. This research examines select material pairings for the most resilient interconnection. The method of test is wire bond pull testing that would represent a continuous strain on a connection and high acceleration testing of up to 50,000 g that would represent a sudden shock that electronics may experience in a drop or crash. Although these two environments may be similar to an overall energy exerted on the connection, the rate of force exerted may lead to different solutions. The results of this research provide insight into material selection for printed electronic interconnections and a framework for interconnection resiliency assessment, which is a critical aspect in realizing the production of next generation electronics technologies for the most demanding environments.

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Section: Introductionmentioning

confidence: 99%

“…Alloys of In are also not as susceptible to thermal aging but it is significantly more expensive than Bi [53,57,59]. A small addition of silver (Ag) with typical weight composition less than 1% in Bi and In solder alloys can improve the reduced properties in both alloys [52,55,57,58,60].…”

Section: Introductionmentioning

confidence: 99%