Measurement study of residual stress on tungsten-rhenium thin film thermocouples by nanoindentation technology

Tian, Bian; Yu, Qiuyue; Zhang, Zhongkai; Lin, Qijing; Zhao, Na; Jing, Weixuan

doi:10.1109/nems.2017.8017139

Cited by 4 publications

(3 citation statements)

References 6 publications

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“…The SiC substrate had a diameter of 6 in and a thickness of 0.4 mm, which was cleaned ultrasonically in the bath of pure alcohol and then acetone, respectively. The relevant parameters [ 16 , 17 ] are shown in Table 1 .…”

Section: Methodsmentioning

confidence: 99%

Horizontal Oxidation Diffusion Behavior of MEMS-Based Tungsten-Rhenium Thin Film Thermocouples

et al. 2022

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Tungsten-rhenium thin film thermocouples (TFTCs) are well suited for the surface temperature monitoring of hot components due to their small size, rapid response and low cost. In this study, a tungsten-rhenium TFTC with SiC protective film on all parts except the pads was fabricated by a microelectromechanical system (MEMS) process. During the low to medium temperature (−40 °C to 500 °C) repeatability test phase, the thermal voltage from the TFTC agreed well with that of the standard tungsten-rhenium thermocouple. However, during the high temperature test phase, the TFTC lost electronic response at around 620 °C. Failure analysis of the TFTC tested at 620 °C was performed by microscopy, scanning electron microscope (SEM), energy dispersive spectroscopy (EDS), laser scanning confocal microscope (LSCM) and statistics. The results showed that the pads were oxidized without the protective layer, the number of oxidized protrusions distributed in this TFTC from the pad to the node decreases more and more slowly and the size of the oxidized protrusions also becomes smaller and smaller. This demonstrates the presence of horizontal oxidation diffusion in TFTCs, further illustrating the importance of pad protection and provides a direction for the subsequent structural optimization and the extension of the service life of TFTCs and other sensors.

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Section: Methodsmentioning

confidence: 99%

Horizontal Oxidation Diffusion Behavior of MEMS-Based Tungsten-Rhenium Thin Film Thermocouples

et al. 2022

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“…A nano-indentation apparatus (G200, Agilent Technologies Inc. (China), Beijing, China) with a three sided pyramid Cube-Corner indenter (54.7356°) is used to test the hardness and elastic modulus of films with the selected loading process [10]. …”

Section: Simulation and Optimizationmentioning

confidence: 99%

“…To compare with the simulation results of FEA, nano-indentation experiments are done to measure and calculate the film stress, shown in Figure 9 . A nano-indentation apparatus (G200, Agilent Technologies Inc. (China), Beijing, China) with a three sided pyramid Cube-Corner indenter (54.7356°) is used to test the hardness and elastic modulus of films with the selected loading process [ 10 ].…”

Section: Simulation and Optimizationmentioning

confidence: 99%

Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates

Zhang

Tian

et al. 2017

Sensors

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A thermal stress range analysis of tungsten-rhenium thin film thermocouples based on ceramic substrates is presented to analyze the falling off and breakage problems caused by the mismatch of the thermal stresses in thin film thermocouples (TFTCs) and substrate, and nano-indentation experiments are done to measure and calculate the film stress to compare with the simulation results. Optimal design and fabrication of tungsten-rhenium TFTCs based on ceramic substrates is reported. Static high temperature tests are carried out, which show the optimization design can effectively reduce the damage caused by the thermal stress mismatch.

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A CMOS compatible GHz ultrasonic pulse phase shift based temperature sensor

Abdelmejeed

Kuo

Lal

2018

2018 IEEE Micro Electro Mechanical Systems (MEMS)

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Measurement study of residual stress on tungsten-rhenium thin film thermocouples by nanoindentation technology

Cited by 4 publications

References 6 publications

Horizontal Oxidation Diffusion Behavior of MEMS-Based Tungsten-Rhenium Thin Film Thermocouples

Horizontal Oxidation Diffusion Behavior of MEMS-Based Tungsten-Rhenium Thin Film Thermocouples

Range Analysis of Thermal Stress and Optimal Design for Tungsten-Rhenium Thin Film Thermocouples Based on Ceramic Substrates

A CMOS compatible GHz ultrasonic pulse phase shift based temperature sensor

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