Measurement and Isolation of Thermal Stress in Silicon-On-Glass MEMS Structures

Chen, Zhiyong; Guo, Meifeng; Zhang, Rong; Zhou, Bin; Wei, Qi

doi:10.3390/s18082603

Cited by 15 publications

(5 citation statements)

References 24 publications

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“…Preventing a mismatch of the coefficients of thermal expansion (CTE) in the production of MEMS devices is of great importance to reduce thermal stress at the material boundaries. [ 295 ] This is particularly important at high temperatures, which are which are needed in solder reflow processes. With printed electronics technologies, low temperature processible materials can be used and temperature variations can be largely avoided.…”

Section: Applicationsmentioning

confidence: 99%

Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

Zikulnig

Chang

Bito³

et al. 2023

Advanced Sensor Research

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Requirements for the miniaturization of electronics are constantly increasing as more and more functions are aimed to be integrated into a single device. At the same time, there are strong demands for low-cost manufacturing, environmental compatibility, rapid prototyping, and small-scale productions due to fierce competition, policies, rapid technical progress, and short innovation times. Altogether, those challenges cannot be sufficiently addressed by simply using either printed or silicon electronics. Instead, the synergies from combining those two technologies into so-called hybrid electronics create novel opportunities for advanced capabilities and new areas of applications. In the first part of this review, printing and patterning technologies are presented with potential compatibility with conventional electronics manufacturing techniques. They can be utilized for the fabrication of highly complex structures. Nonetheless, up-scalability, integration, and adaptation for industrial fabrication remain challenging due to technically limiting factors. Consequently, a special focus is placed on the up-scalability, availability of commercial printing, and manufacturing machines, as well as processing challenges for high-volume industrial applications. The second part of this review further provides an overview of exciting and innovative application possibilities of printed electronics, emphasizing sensor applications, as well as additively manufactured integrated circuits.

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Section: Applicationsmentioning

confidence: 99%

Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

Zikulnig

Chang

Bito³

et al. 2023

Advanced Sensor Research

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“…In the SOIMUMPs process, the stress gradient in the device layer used for creating the mechanical structures originates primarily during the doping step [ 48 ]. In addition, the difference in coefficients of thermal expansion is also significant when multiple layers are in contact [ 54 , 55 ]. This effect can be incorporated in the model if the stresses of the constituent layers are known.…”

Section: Sensor Designmentioning

confidence: 99%

Dual Band MEMS Directional Acoustic Sensor for Near Resonance Operation

Alves

Rabelo

Karunasiri

2022

Sensors

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In this paper, we report on the design and characterization of a microelectromechanical systems (MEMS) directional sensor inspired by the tympana configuration of the parasitic fly Ormia ochracea. The sensor is meant to be operated at resonance and act as a natural filter for the undesirable frequency bands. By means of breaking the symmetry of a pair of coupled bridged membranes, two independent bending vibrational modes can be excited. The electronic output, obtained by the transduction of the vibration to differential capacitance and then voltage through charge amplifiers, can be manipulated to tailor the frequency response of the sensor. Four different frequency characteristics were demonstrated. The sensor exhibits, at resonance, mechanical sensitivity around 6 μm/Pa and electrical sensitivity around 13 V/Pa. The noise was thoroughly characterized, and it was found that the sensor die, rather than the fundamental vibration, induces the predominant part of the noise. The computed average signal-to-noise (SNR) ratio in the pass band is about 91 dB. This result, in combination with an accurate dipole-like directional response, indicates that this type of directional sensor can be designed to exhibit high SNR and selectable frequency responses demanded by different applications.

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“…The measurement of stress includes three kinds of methods: non-destructive, micro-damage, and damage [ 10 , 11 , 12 , 13 , 14 ]. Both damage and micro-damage measurement methods can cause damage to the measured part and these damages are fatal to the finished parts or the workpieces in service.…”

Section: Introductionmentioning

confidence: 99%

Study on Propagation Depth of Ultrasonic Longitudinal Critically Refracted (LCR) Wave

Liu

Chen

et al. 2020

Sensors

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The accurate measurement of stress at different depths in the end face of a high-pressure compressor rotor is particularly important, as it is directly related to the assembly quality and overall performance of aero-engines. The ultrasonic longitudinal critically refracted (LCR) wave is sensitive to stress and can measure stress at different depths, which has a prominent advantage in stress non-destructive measurements. In order to accurately characterize the propagation depth of LCR waves and improve the spatial resolution of stress measurement, a finite element model suitable for the study of LCR wave propagation depths was established based on a wave equation and Snell law, and the generation and propagation process of LCR waves are analyzed. By analyzing the blocking effect of grooves with different depths on the wave, the propagation depth of the LCR wave at seven specific frequencies was determined in turn. On this basis, the LCR wave propagation depth model is established, and the effects of wedge materials, piezoelectric element diameters, and excitation voltages on the propagation depth of LCR waves are discussed. This study is of great significance to improve the spatial resolution of stress measurements at different depths in the end face of the aero-engine rotor.

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Measurement and Isolation of Thermal Stress in Silicon-On-Glass MEMS Structures

Cited by 15 publications

References 24 publications

Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

Printed Electronics Technologies for Additive Manufacturing of Hybrid Electronic Sensor Systems

Dual Band MEMS Directional Acoustic Sensor for Near Resonance Operation

Study on Propagation Depth of Ultrasonic Longitudinal Critically Refracted (LCR) Wave

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