Measurement and analysis of contact resistance in wafer probe testing

Liu, D.S.; Shih, Meng-Kai; Huang, Wen-Yao

doi:10.1016/j.microrel.2006.07.091

Cited by 15 publications

(3 citation statements)

References 6 publications

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“…[14][15][16][17][18][19] Such MEMS microcoils are applied to coil springs used for providing appropriate contact forces in fine electrode probe pins of semiconductor device testers with large-scale integration (LSI). [20][21][22][23][24][25] However, because LSI devices are aggressively integrated and refined further, electrode pitches are expected to be shortened corresponding to device integration and miniaturization. Accordingly, the tester probe pin pitches have to be decreased.…”

Section: Introductionmentioning

confidence: 99%

“…For this reason, various types of minute contact probes have been proposed. [26][27][28][29][30][31] Contact probe pins with built-in coil springs are advantageous for shortening the pin pitch two dimensionally in comparison with microprobes supported by cantilevers because the probe pins with built-in coil springs need small spaces for support. However, the microcoil springs built in the probe pins should be downsized further to make the probe-pin diameter drastically smaller.…”

Section: Introductionmentioning

confidence: 99%

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New Laser-Scan Exposure System for Delineating Precise Helical Patterns onto Sub-50-µm Wires

Horiuchi

Sasaki

2012

Jpn. J. Appl. Phys.

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A new laser-scan exposure system for patterning onto fine wires and pipes with diameters as small as 40 m was developed. New schemes for vertically holding specimens were adopted, and improved optics of imaging and in situ observation were used. In addition, specially contrived halfvacuum support guides were attached, and a short-wavelength violet laser with a wavelength of 408 nm was also attached. Because the laser beam spot was kept steady at a constant size by the improved half-vacuum support guide with triple narrow slits, patterns with homogeneous widths of approximately 20 m were constantly delineated suppressing the width fluctuations to less than AE2 m. In addition, owing to the shortwavelength laser, exposure time was greatly decreased to approximately 1/10 compared with the previous system. The new exposure system will be applicable to development of fine microcomponents such as microcoils useful for very fine probe pins of semiconductor device testers.

show abstract

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

New Laser-Scan Exposure System for Delineating Precise Helical Patterns onto Sub-50-µm Wires

Horiuchi

Sasaki

2012

Jpn. J. Appl. Phys.

View full text Add to dashboard Cite

show abstract

“…For this reason, various types of minute contact probes have been proposed. [1][2][3][4][5][6] Contact probe pins with built-in coil springs are advantageous for shortening the pin pitch two dimensionally in comparison to microprobes supported by cantilevers because the probe pins with built-in coil springs need small spaces for support. However, probe pins to realize contact with the electrodes must be miniaturized while retaining an adequate contact force.…”

Section: Introductionmentioning

confidence: 99%

Novel Fabrication Method of Microcoil Springs Using Laser-Scan Helical Patterning and Nickel Electroplating

Horiuchi

Ishii

Shinozaki

et al. 2011

Jpn. J. Appl. Phys.

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A novel microcoil fabrication method was developed. In the past research, copper microcoils were fabricated by wet-etching copper pipes with helical resist patterns formed using laser-scan lithography. However, etched coil widths often locally fluctuated owing to the influence of the surface and backsurface conditions of the pipes, and it was difficult to consistently fabricate microcoils with homogeneous widths. For this reason, in the new method, microcoils are fabricated by nickel electroplating instead of etching. After forming helical patterns on a fine stainless-steel wire with a diameter of 80 µm, nickel was electroplated in the spaces of resist patterns. Because the adhesion of nickel to the stainless-steel wire was not very strong, helically electroplated nickel was tore off from the core wire, and the microcoil was fabricated when the wire was pulled and lengthened. Next, helical pattern widths and nickel coil widths were evaluated. The homogeneity and reproducibility of both widths were very good, and width variations of nickel microcoils were almost the same level as those of resist space patterns. This finding was considered to indicate that the width fluctuation occurring during the electroplating process was very small. The fabricated nickel coils showed almost linear spring characteristics when they were repeatedly compressed and released. The spring constant of the fabricated coil was approximately 0.16 N/mm. The new method and the fabricated nickel coils will be of practical use.

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Automatic alignment and testing system for wafer with ball grid array

Chen

Xiao

et al. 2016

Optik

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Measurement and analysis of contact resistance in wafer probe testing

Cited by 15 publications

References 6 publications

New Laser-Scan Exposure System for Delineating Precise Helical Patterns onto Sub-50-µm Wires

New Laser-Scan Exposure System for Delineating Precise Helical Patterns onto Sub-50-µm Wires

Novel Fabrication Method of Microcoil Springs Using Laser-Scan Helical Patterning and Nickel Electroplating

Automatic alignment and testing system for wafer with ball grid array

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